Intel Xeon 5500 Series, Design Manual

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Introduction
10 Thermal/Mechanical Design Guide
1.1 References
Material and concepts available in the following documents may be beneficial when
reading this document.
Notes:
1. Document numbers indicated in Location column are subject to change. See the appropriate Electronic
Design Kit (EDK) for the most up-to-date Document number.
2. Available at http://www.blauer-engel.de
3. Available at http://ssiforum.oaktree.com/
1.2 Definition of Terms
Table 1-1. Reference Documents
Document Location Notes
European Blue Angel Recycling Standards 2
Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 321321 1
Intel® Xeon® Processor 5500 Series Mechanical Model 321326 1
Intel® Xeon® Processor 5500 Series Thermal Model 321327 1
Entry-level Electronics Bay Specification 3
Table 1-2. Terms and Descriptions (Sheet 1 of 2)
Term Description
Bypass Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC
activation temperature.
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
ILM Independent Loading Mechanism provides the force needed to seat the 1366-LGA land
package onto the socket contacts.
LGA1366 socket The processor mates with the system board through this surface mount, 1366-contact
socket.
PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides
a communication channel between Intel processor and chipset components to external
monitoring devices.
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
CASE
– T
LA
) / Total
Package Power. Heat source should always be specified for Ψ measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
CASE
– T
S
) / Total
Package Power.
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
S
– T
LA
) / Total Package Power.
T
CASE
The case temperature of the processor measured at the geometric center of the topside
of the IHS.
T
CASE
_
MAX
The maximum case temperature as specified in a component specification.
TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
by using clock modulation and/or operating frequency and input voltage adjustment
when the die temperature is very near its operating limits.