Thermal/Mechanical Design Guide
37
Thermal Solutions
5.5.2
Dual Thermal Profile
Processors that offer dual thermal profile are specified in the appropriate Datasheet.
Dual thermal profile helps mitigate limitations in volumetrically constrained form
factors and allows trade-offs between heatsink cost and TCC activation risk. For
heatsinks that comply to Profile B, yet do not comply to Profile A (1U heatsink in
Figure 5-5
), the processor has an increased probability of TCC activation and an
associated measurable performance loss. Measurable performance loss is defined to be
any degradation in processor performance greater than 1.5%. 1.5% is chosen as the
baseline since run-to-run variation in a performance benchmark is typically between 1
and 2%.
Figure 5-4. Processor Thermal Characterization Parameter Relationships
Summary of Contents for Xeon 5500 Series
Page 8: ...8 Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Page 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Page 42: ...Thermal Solutions 42 Thermal Mechanical Design Guide ...
Page 50: ...Component Suppliers 50 Thermal Mechanical Design Guide ...
Page 78: ...Mechanical Drawings 78 Thermal Mechanical Design Guide ...
Page 84: ...Socket Mechanical Drawings 84 Thermal Mechanical Design Guide ...
