Thermal/Mechanical Design Guide
9
Introduction
1
Introduction
This document provides guidelines for the design of thermal and mechanical solutions
for 2-socket server and 2-socket Workstation processors in the Intel® Xeon® 5500
Platform. The processors covered include those listed in the
Intel® Xeon® Processor
5500 Series Datasheet, Volume 1
and the follow-on processors. The design guidelines
apply to the follow-on processors in their current stage of development and are not
expected to change as they mature. The components described in this document
include:
• The processor thermal solution (heatsink) and associated retention hardware.
• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back
plate.
Processors in 1-socket Workstation platforms are covered in the Intel® Xeon®
Processor 3500 Series Thermal/Mechanical Design Guide.
The goals of this document are:
• To assist board and system thermal mechanical designers.
• To assist designers and suppliers of processor heatsinks.
Thermal profiles and other processor specifications are provided in the Datasheet.
Figure 1-1. Intel® Xeon® 5500 Platform Socket Stack
Heatsink
Socket and ILM
Back Plate
Summary of Contents for Xeon 5500 Series
Page 8: ...8 Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Page 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Page 42: ...Thermal Solutions 42 Thermal Mechanical Design Guide ...
Page 50: ...Component Suppliers 50 Thermal Mechanical Design Guide ...
Page 78: ...Mechanical Drawings 78 Thermal Mechanical Design Guide ...
Page 84: ...Socket Mechanical Drawings 84 Thermal Mechanical Design Guide ...
