Thermal/Mechanical Design Guide
31
Thermal Solutions
5
Thermal Solutions
This section describes a 1U reference heatsink, design targets for 2U and Tower
heatsinks, performance expectations for a 25.5 mm tall heatsink, and thermal design
guidelines for Intel® Xeon® Processor 5500 Series and the follow-on processors.
5.1
Performance Targets
Table 5-1
provides boundary conditions and performance targets for 1U, 2U and Tower
heatsinks. These values are used to generate processor thermal specifications and to
provide guidance for heatsink design.
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (
Section 5.5.1
).
3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H
2
O.
4. Reference system configuration. Processor is downstream from memory in EEB (Entry-Level Electronics Bay).
Ducting is utilized to direct airflow.
5. The 1U heatsink can also meet Profile B for the 95W processor in TEB (Thin Electronics Bay) under the
following conditions: TLA = 40ºC,
Ψ
CA = 0.275ºC/W, airflow = 16 CFM @ 0.344” dP (these TEB values are
not used to generate processor thermal specifications). Processor is not downstream from memory in TEB.
Ducting is utilized to direct airflow.
6. Dimensions of heatsink do not include socket or processor.
7. The 2U heatsink height (64mm) + socket/processor height (7.729 mm,
Table 4-2
) complies with 76.2 mm
max height for EEB monoplanar boards (http://ssiforum.oaktree.com/).
8. Passive heatsinks. PCM45F thermal interface material.
9. WS = Workstation.
Table 5-1.
Boundary Conditions and Performance Targets
Parameter
Value
Altitude, system
ambient temp
Sea level, 35
o
C
TDP
60W
80W
95W, Profile B
95W, Profile A
130W, WS
9
T
LA
1
49
o
C
49
o
C
49
o
C
55
o
C
40
o
C
Ψ
CA
2
0.335
o
C/W
0.336
o
C/W
0.337
o
C/W
0.201
o
C/W
0.201
o
C/W
Airflow
3
9.7 CFM @
0.20” dP
9.7 CFM @
0.20” dP
9.7 CFM @
0.20” dP
30 CFM @
0.205” dP
30 CFM @
0.205” dP
System height
(form factor)
4
1U (EEB)
1U (EEB)
1U (EEB)
5
2U (EEB)
Pedestal (EEB)
Heatsink
volumetric
90 x 90 x 27mm (1U)
6
90 x 90 x 64mm
(2U)
6,7
90 x 90 x 99mm
(Tower)
6
Heatsink
technology
8
Cu base, Al fins
Cu/Al base, Al fins with heatpipes
Summary of Contents for Xeon 5500 Series
Page 8: ...8 Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Page 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Page 42: ...Thermal Solutions 42 Thermal Mechanical Design Guide ...
Page 50: ...Component Suppliers 50 Thermal Mechanical Design Guide ...
Page 78: ...Mechanical Drawings 78 Thermal Mechanical Design Guide ...
Page 84: ...Socket Mechanical Drawings 84 Thermal Mechanical Design Guide ...
