Thermal/Mechanical Specifications and Design Guidelines
69
Boxed Processor Specifications
10.4
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution used by the
boxed processor.
10.4.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
temperature specification is found in
of this document. The boxed processor
fan heatsink is able to keep the processor temperature within the specifications (see
) in chassis that provide good thermal management. For the boxed processor
fan heatsink to operate properly, it is critical that the airflow provided to the fan
heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the
sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow
through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink
reduces the cooling efficiency and decreases fan life.
and
illustrate an acceptable airspace clearance for the fan heatsink. The air temperature
entering the fan should be kept below 40 ºC. Again, meeting the processor's
temperature specification is the responsibility of the system integrator.
Table 10-1. Fan Heatsink Power and Signal Specifications
Description
Min
Typ
Max
Unit
Notes
+12 V: 12 volt fan power supply
11.4
12.0
12.6
V
—
IC:
• Maximum fan steady-state current draw
• Average steady-state fan current draw
• Maximum fan start-up current draw
• Fan start-up current draw maximum duration
—
—
—
—
1.2
0.5
2.2
1.0
—
—
—
—
A
A
A
Second
—
SENSE: SENSE frequency
—
2
—
pulses per fan
revolution
1
NOTES:
1. Baseboard should pull this pin up to 5 V with a resistor.
CONTROL
21
25
28
kHz
2, 3
2. Open drain type, pulse width modulated.
3. Fan will have pull-up resistor for this signal to maximum of 5.25 V.
Figure 10-6. Baseboard Power Header Placement Relative to Processor Socket
B
C
R110
[4.33]
Summary of Contents for i5-700
Page 30: ...Independent Loading Mechanism ILM 30 Thermal Mechanical Specifications and Design Guidelines...
Page 88: ...Mechanical Drawings 88 Thermal Mechanical Specifications and Design Guidelines...
Page 94: ...Socket Mechanical Drawings 94 Thermal Mechanical Specifications and Design Guidelines...
Page 98: ...Package Mechanical Drawings 98 Thermal Mechanical Specifications and Design Guidelines...
Page 102: ...Heat Sink Back Plate Drawings 102 Thermal Mechanical Specifications and Design Guidelines...
