Intel i5-700, Specifications

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Thermal/Mechanical Specifications and Design Guidelines 9
Introduction
1
Introduction
This document differs from previous Thermal and Mechanical Design Guidelines. In this
document, mechanical and thermal specifications for the processor and the associated
socket are now included. The usual design guidance has been retained.
The components described in this document include:
• The thermal and mechanical specifications for the
— Intel Core™ i7-800 and i5-700 desktop processor series
• The LGA1156 socket and the Independent Loading Mechanism (ILM) and back
plate.
• The reference design thermal solution (heatsink) for the processors and associated
retention hardware.
Note: When the information is applicable to all products, the this document will use
“processor” or “processors” to simplify the document.
1.1 References
Material and concepts available in the following documents may be beneficial when
reading this document.
Table 1-1. Reference Documents
Document Location
Intel
®
Core™ i7-800 and i5-700 Desktop Processor Series Datasheet, Volume 1
http://download.intel.com/
design/processor/datashts/
322164.pdf
Intel
®
Core™ i7-800 and i5-700 Desktop Processor Series Datasheet, Volume 2
http://download.intel.com/
design/processor/datashts/
322165.pdf
Intel
®
Core™ i7-800 and i5-700 Desktop Processor Series Specification Update
http://download.intel.com/
design/processor/
specupdt/322166.pdf
Intel
®
5 Series Chipset and Intel
®
3400 Chipset Datasheet
www.intel.com/Assets/
PDF/datasheet/322169.pdf
Intel
®
5 Series Chipset and Intel
®
3400 Chipset Specification Update
www.intel.com/Assets/
PDF/specupdate/
322170.pdf
Intel
®
5 Series Chipset and Intel
®
3400 Chipset – Thermal Mechanical
Specifications and Design Guidelines
www.intel.com/Assets/
PDF/designguide/
322171.pdf
4-Wire Pulse Width Modulation (PWM) Controlled Fans
http://
www.formfactors.org/