Thermal/Mechanical Specifications and Design Guidelines
51
Sensor Based Thermal Specification Design Guidance
7.3
Thermal Solution Design Process
Thermal solution design guidance for this specification is the same as with previous
products. The initial design needs to take into account the target market and overall
product requirements for the system. This can be broken down into several steps:
• Boundary condition definition
• Thermal design / modelling
• Thermal testing
7.3.1
Boundary Condition Definition
Using the knowledge of the system boundary conditions such as inlet air temperature,
acoustic requirements, cost, design for manufacturing, package and socket mechanical
specifications and chassis environmental test limits the designer can make informed
thermal solution design decisions.
For the and Intel Core™ i7-800 and i5-700 desktop processor series, the thermal
boundary conditions for an ATX tower system are as follows:
• T
EXTERNAL
= 35 °C. This is typical of a maximum system operating environment
• T
RISE
= 5 °C. This is typical of a chassis compliant to CAG 1.1 or TAC 2.0.
• T
AMBIENT
= 40 °C (T
AMBIENT
= T
EXTERNAL
+ T
RISE
)
Based on the system boundary conditions the designer can select a T
AMBIENT
and
Ψ
CA
to use in thermal modelling. The assumption of a T
AMBIENT
has a significant impact on
the required
Ψ
CA
needed to meet TTV T
CASEMAX
at TDP. A system that can deliver lower
assumed T
AMBIENT
can utilize a design with a
higher
Ψ
CA
, which can have a lower cost.
shows a number of satisfactory solutions for the Intel Core™ i7-800 and i5-
700 desktop processor series.
Note:
If the assumed T
AMBIENT
is inappropriate for the intended system environment, the
thermal solution performance may not be sufficient to meet the product requirements.
The results may be excessive noise from fans having to operate at a speed higher than
intended. In the worst case this can lead to performance loss with excessive activation
of the Thermal Control Circuit (TCC).
Summary of Contents for i5-700
Page 30: ...Independent Loading Mechanism ILM 30 Thermal Mechanical Specifications and Design Guidelines...
Page 88: ...Mechanical Drawings 88 Thermal Mechanical Specifications and Design Guidelines...
Page 94: ...Socket Mechanical Drawings 94 Thermal Mechanical Specifications and Design Guidelines...
Page 98: ...Package Mechanical Drawings 98 Thermal Mechanical Specifications and Design Guidelines...
Page 102: ...Heat Sink Back Plate Drawings 102 Thermal Mechanical Specifications and Design Guidelines...
