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Thermal/Mechanical Specifications and Design Guidelines
73
Component Suppliers
A
Component Suppliers
Note:
The part numbers listed below identifies the reference components. End-users are
responsible for the verification of the Intel enabled component offerings with the
supplier. These vendors and devices are listed by Intel as a convenience to Intel's
general customer base, but Intel does not make any representations or warranties
whatsoever regarding quality, reliability, functionality, or compatibility of these devices.
Customers are responsible for thermal, mechanical, and environmental validation of
these solutions. This list and/or these devices may be subject to change without notice.
Table A-1.
Reference Heatsink Enabled Components
Item
Intel PN
AVC
Delta
Foxconn
ITW
Nidec
2009B Heatsink
Assembly
RCFH7-1156
(DHA-A)
E41759-002
N/A
DTC-DAA07
1A01C7T00-
DHA_XA02
N/A
F90T12MS1Z
7-64A01A1
Clip
E36830-001
A208000389
N/A
N/A
N/A
N/A
Fastener
Base:
C33389
Cap:
E63768-001
N/A
N/A
N/A
Base:
C33389
Cap:
E63768-001
N/A
Table A-2. LGA1156 Socket and ILM Components
Item
Intel PN
Foxconn
Molex
Tyco
Lotes
LGA1156 Socket
E51948-002
PE115627-
4041-01F
475961132
2013092-1
N/A
LGA1156 ILM
E36142-002
PT44L11-6401
475969910
2013882-3
ACA-ZIF-078-
T02
Back Plate
(with Screws)
E36143-002
PT44P11-6401
475969930
2069838-2
DCA-HSK-144-
T01
Summary of Contents for i5-700
Page 30: ...Independent Loading Mechanism ILM 30 Thermal Mechanical Specifications and Design Guidelines...
Page 88: ...Mechanical Drawings 88 Thermal Mechanical Specifications and Design Guidelines...
Page 94: ...Socket Mechanical Drawings 94 Thermal Mechanical Specifications and Design Guidelines...
Page 98: ...Package Mechanical Drawings 98 Thermal Mechanical Specifications and Design Guidelines...
Page 102: ...Heat Sink Back Plate Drawings 102 Thermal Mechanical Specifications and Design Guidelines...