Thermal/Mechanical Specifications and Design Guidelines
33
LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications
5.5
Electrical Requirements
LGA1156 socket electrical requirements are measured from the socket-seating plane of
the processor to the component side of the socket PCB to which it is attached. All
specifications are maximum values (unless otherwise stated) for a single socket
contact, but includes effects of adjacent contacts where indicated.
Table 5-4.
Electrical Requirements for LGA1156 Socket
Parameter
Value
Comment
Mated loop inductance, Loop
<3.6nH
The inductance calculated for two contacts,
considering one forward conductor and one
return conductor. These values must be satisfied
at the worst-case height of the socket.
Socket Average Contact Resistance
(EOL)
19 mOhm
The socket average contact resistance target is
calculated from the following equation:
sum (Ni X LLCRi) / sum (Ni)
• LLCRi is the chain resistance defined as the
resistance of each chain minus resistance of
shorting bars divided by number of lands in
the daisy chain.
• Ni is the number of contacts within a chain.
• I is the number of daisy chain, ranging from
1 to 119 (total number of daisy chains).
The specification listed is at room temperature
and has to be satisfied at all time.
Max Individual Contact Resistance
(EOL)
100 mOhm
The specification listed is at room temperature
and has to be satisfied at all time.
Socket Contact Resistance:
The resistance of
the socket contact, solderball, and interface
resistance to the interposer land; gaps included.
Bulk Resistance Increase
≤
3
m
Ω
The bulk resistance increase per contact from
25 °C to 100 °C.
Dielectric Withstand Voltage
360 Volts RMS
Insulation Resistance
800 M
Ω
Summary of Contents for i5-700
Page 30: ...Independent Loading Mechanism ILM 30 Thermal Mechanical Specifications and Design Guidelines...
Page 88: ...Mechanical Drawings 88 Thermal Mechanical Specifications and Design Guidelines...
Page 94: ...Socket Mechanical Drawings 94 Thermal Mechanical Specifications and Design Guidelines...
Page 98: ...Package Mechanical Drawings 98 Thermal Mechanical Specifications and Design Guidelines...
Page 102: ...Heat Sink Back Plate Drawings 102 Thermal Mechanical Specifications and Design Guidelines...
