Intel i5-700, Specifications

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Thermal/Mechanical Specifications and Design Guidelines 3
Contents
1 Introduction ..............................................................................................................9
1.1 References .........................................................................................................9
1.2 Definition of Terms ............................................................................................ 10
2 Package Mechanical and Storage Specifications ....................................................... 11
2.1 Package Mechanical Specifications ....................................................................... 11
2.1.1
Package Mechanical Drawing.................................................................... 12
2.1.2 Processor Component Keep-Out Zones...................................................... 12
2.1.3 Package Loading Specifications ................................................................ 13
2.1.4 Package Handling Guidelines.................................................................... 13
2.1.5 Package Insertion Specifications............................................................... 13
2.1.6 Processor Mass Specification.................................................................... 13
2.1.7 Processor Materials................................................................................. 14
2.1.8 Processor Markings................................................................................. 14
2.1.9 Processor Land Coordinates ..................................................................... 15
2.2 Processor Storage Specifications ......................................................................... 16
3 LGA1156 Socket ...................................................................................................... 17
3.1 Board Layout .................................................................................................... 19
3.2 Attachment to Motherboard ................................................................................ 20
3.3 Socket Components........................................................................................... 20
3.3.1
Socket Body Housing .............................................................................. 20
3.3.2 Solder Balls ........................................................................................... 21
3.3.3 Contacts ............................................................................................... 21
3.3.4 Pick and Place Cover............................................................................... 21
3.4 Package Installation / Removal ........................................................................... 22
3.4.1
Socket Standoffs and Package Seating Plane.............................................. 23
3.5 Durability ......................................................................................................... 23
3.6 Markings .......................................................................................................... 24
3.7 Component Insertion Forces ............................................................................... 24
3.8 Socket Size ...................................................................................................... 24
4 Independent Loading Mechanism (ILM) ................................................................... 25
4.1 Design Concept................................................................................................. 25
4.1.1
ILM Cover Assembly Design Overview ....................................................... 25
4.1.2 ILM Back Plate Design Overview............................................................... 26
4.1.3 Shoulder Screw and Fasteners Design Overview ......................................... 27
4.2 Assembly of ILM to a Motherboard....................................................................... 28
4.3 ILM Interchangeability ....................................................................................... 29
4.4 Markings .......................................................................................................... 29
5 LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications . 31
5.1 Component Mass............................................................................................... 31
5.2 Package/Socket Stackup Height .......................................................................... 31
5.3 Socket Maximum Temperature............................................................................ 32
5.4 Loading Specifications........................................................................................ 32
5.5 Electrical Requirements...................................................................................... 33
5.6 Environmental Requirements .............................................................................. 34
6 Thermal Specifications ............................................................................................ 35
6.1 Thermal Specifications ....................................................................................... 35
6.1.1
Intel
®
Core™ i7-800 and i5-700 Desktop Processor Series Thermal Profile ..... 37
6.1.2 Processor Specification for Operation Where Digital
Thermal Sensor Exceeds T
CONTROL
............................................................ 39