Mechanical Drawings
76
Thermal/Mechanical Specifications and Design Guidelines
Figure B-1. Socket / Heatsink / ILM Keepout Zone Primary Side (Top)
(
)
95.0
(75.00
2X)
(75.00
2X)
(95.00
)
(95.00
)
(36.00
)
4X
NPTH
4.03
+0.05 -0.03
4X
NO ROUTE
6.00
+0.05 -0.03
3X
NPTH
3.80
+0.05 -0.03
3X
NO ROUTE ON
PRIMARY
& SECONDARY SIDES
6
3 X
4.70 NO ROUTE ON
ALL OTHER LAYERS
6.00
+0.05 -0.03
40.71
0.00
35.21
2X
25.25
2X
21.25
10.50
5.40
20.90
26.70
25.81
37.31
45.50
23.81
40.71
39.63
29.69
38.18
2X
38.12
35.21
20.13
21.25
28.46
2X
38.40
2X
36.89
37.54
18.90
10.00
10.00
NO ROUTE ON
PRIMARY SIDE
6
7.00
2X
37.50
0.00
2X
37.56
29.08
26.11 21.25
6.15
6.15
13.97
31.61
32.50 35.80
2X
37.50
46.42
47.50
2X
39.01
29.67 28.00 26.00
23.70
18.00
18.00
23.70 25.70
25.70
26.00
2X
29.67 30.00
2X
39.01
37.63
47.50
7.62
2.54
26.40
2X
39.49
34.42
40.10
35.03
27.02
25.79
33.80
48.12
46.89
()
6.00
E21319_REV_L_PAE
1
L
DWG. NO
SHT.
REV
DEPARTMENT
R
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
TITLE
LGA1156 & 1155 SOCKET ATX KEEP-INS
SIZE
DRAWING NUMBER
REV
A1
E21319_REV_L_PAE
L
SCALE: NONE
DO NOT SCALE DRAWING
SHEET
1
OF
2
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
THIRD ANGLE PROJECTION
NOTES: 1. DIMENSIONS ARE IN MILLIMETERS.
2
GEOMETRIC CENTER OF SOCKET HOUSING CAVITY.
3. BOARD COMPONENET KEEP-INS AND MECHANICAL COMPONENET KEEP-OUTS TO BE UTILIZED WITH SUFFICIENT ALLOWANCES FOR PLACEMENT AND SIZE TOLERANCES, ASSEMBLY PROCESS ACCESS, AND DYNAMIC EXCURSIONS. 4. ASSUME SYMMETRY FOR UNDIMENSIONED CORNERS AND EDGES.
5
REFER TO INTEL PART DRAWING E21320 FOR ILM AND SOCKET KEEPIN VOLUME DIMENSIONS.
6
COPPER PAD ON PRIMARY SIDE, NON-GROUNDED.
COPPER PAD CAN INSET A MAXIMUM OF 0.127MM FROM THE NO ROUTE EDGE.
7
COMBINED COMPONENT AND SOLDER PASTE HEIGHT INCLUDING TOLERANCES AFTER REFLOW.
BOARD PRIMARY SIDE
2
2
WEST
EAST
SOUTH
NORTH
PIN 1
ILM BOUNDRY
5
LEVER UNHOOKED POSITION
PACKAGE BOUNDRY
SILKSCREEN OUTLINE ON PRIMARY SIDE AS SHOWN
LEGEND
SOCKET/THERMAL/MECHANICAL COMPONENT KEEP-INS
10.10 MM MAX COMPONENT HEIGHT
7
1.6 MM MAX COMPONENT HEIGHT
7
1.2 MM MAX COMPONENT HEIGHT
7
BOARD ROUTING KEEP-OUT
27 MM MAX COMPONENT HEIGHT
7
BOARD ROUTING SURFACE TRACE KEEP-OUT
2.07 MM MAX COMPONENT HEIGHT
7
2.5 MM MAX COMPONENT HEIGHT
7
26 MM MAX COMPONENT HEIGHT
7
Summary of Contents for i5-700
Page 30: ...Independent Loading Mechanism ILM 30 Thermal Mechanical Specifications and Design Guidelines...
Page 88: ...Mechanical Drawings 88 Thermal Mechanical Specifications and Design Guidelines...
Page 94: ...Socket Mechanical Drawings 94 Thermal Mechanical Specifications and Design Guidelines...
Page 98: ...Package Mechanical Drawings 98 Thermal Mechanical Specifications and Design Guidelines...
Page 102: ...Heat Sink Back Plate Drawings 102 Thermal Mechanical Specifications and Design Guidelines...
