Thermal/Mechanical Specifications and Design Guidelines
61
Thermal Solution Quality and Reliability Requirements
9
Thermal Solution Quality and
Reliability Requirements
9.1
Reference Heatsink Thermal Verification
Each motherboard, heatsink and attach combination may vary the mechanical loading
of the component. Based on the end user environment, the user should define the
appropriate reliability test criteria and carefully evaluate the completed assembly prior
to use in high volume. The Intel reference thermal solution will be evaluated to the
boundary conditions in
.
The test results, for a number of samples, are reported in terms of a worst-case mean
+ 3
σ
value for thermal characterization parameter using the TTV.
9.2
Mechanical Environmental Testing
Each motherboard, heatsink and attach combination may vary the mechanical loading
of the component. Based on the end user environment, the user should define the
appropriate reliability test criteria and carefully evaluate the completed assembly prior
to use in high volume. Some general recommendations are shown in
The Intel reference heatsinks will be tested in an assembled LGA1156 socket and
mechanical test package. Details of the environmental requirements, and associated
stress tests, can be found in
are based on speculative use condition
assumptions, and are provided as examples only.
Notes:
1.
It is recommended that the above tests be performed on a sample size of at least ten assemblies from
multiple lots of material.
2.
Additional pass/fail criteria may be added at the discretion of the user.
Table 9-1.
Use Conditions (Board Level)
Test
Requirement
Pass/Fail Criteria
Mechanical Shock
3 drops each for + and - directions in each of 3
perpendicular axes (i.e., total 18 drops)
Profile: 50 g, Trapezoidal waveform, 4.3 m/s [170 in/s]
minimum velocity change
Visual Check and
Electrical Functional
Test
Random Vibration
Duration: 10 min/axis, 3 axes
Frequency Range: 5 Hz to 500 Hz
5 Hz @ 0.01 g
2
/Hz to 20 Hz @ 0.02 g
2
/Hz (slope up)
20 Hz to 500 Hz @ 0.02 g
2
/Hz (flat)
Power Spectral Density (PSD) Profile: 3.13 g RMS
Visual Check and
Electrical Functional
Test
Summary of Contents for i5-700
Page 30: ...Independent Loading Mechanism ILM 30 Thermal Mechanical Specifications and Design Guidelines...
Page 88: ...Mechanical Drawings 88 Thermal Mechanical Specifications and Design Guidelines...
Page 94: ...Socket Mechanical Drawings 94 Thermal Mechanical Specifications and Design Guidelines...
Page 98: ...Package Mechanical Drawings 98 Thermal Mechanical Specifications and Design Guidelines...
Page 102: ...Heat Sink Back Plate Drawings 102 Thermal Mechanical Specifications and Design Guidelines...
