Thermal/Mechanical Specifications and Design Guidelines
65
Boxed Processor Specifications
10
Boxed Processor Specifications
10.1
Introduction
The processor will also be offered as an Intel boxed processor. Intel boxed processors
are intended for system integrators who build systems from baseboards and standard
components. The boxed processor will be supplied with a cooling solution. This chapter
documents baseboard and system requirements for the cooling solution that will be
supplied with the boxed processor. This chapter is particularly important for OEMs that
manufacture baseboards for system integrators.
Note:
Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and
inches [in brackets].
shows a mechanical representation of a boxed
processor.
Note:
The cooling solution that is supplied with the boxed processor will be halogen free
compliant.
Note:
Drawings in this chapter reflect only the specifications on the Intel boxed processor
product. These dimensions should not be used as a generic keep-out zone for all
cooling solutions. It is the system designers’ responsibility to consider their proprietary
cooling solution when designing to the required keep-out zone on their system
platforms and chassis. Refer to the
for further guidance on keep in and
keep out zones.
Note:
The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.
Figure 10-1. Boxed Processor Fan Heatsink
Summary of Contents for i5-700
Page 30: ...Independent Loading Mechanism ILM 30 Thermal Mechanical Specifications and Design Guidelines...
Page 88: ...Mechanical Drawings 88 Thermal Mechanical Specifications and Design Guidelines...
Page 94: ...Socket Mechanical Drawings 94 Thermal Mechanical Specifications and Design Guidelines...
Page 98: ...Package Mechanical Drawings 98 Thermal Mechanical Specifications and Design Guidelines...
Page 102: ...Heat Sink Back Plate Drawings 102 Thermal Mechanical Specifications and Design Guidelines...
