Thermal/Mechanical Specifications and Design Guidelines
79
Mechanical Drawings
Figure B-4. Socket / Processor / ILM Keepout Zone Secondary Side (Bottom)
SIZE
DRAWING NUMBER
REV
A1
E21320
J
SCALE: NONE
DO NOT SCALE DRAWING
SHEET
2
OF
2
0.1
B
C
25.81
18.00
0.00
0.00
18.00
3X
NO ROUTE ON PRIMARY
& SECONDARY SIDES
3 X
4.70 NO ROUTE ON
ALL OTHER LAYERS COPPER PAD ON PRIMARY SIDE, NON-GROUNDED. COPPER PAD CAN INSET MAXIMUM OF .127MM FROM THE NO ROUTE EDGE
6.00
+0.05 -0.03
3X
NPTH
3.80
+0.05 -0.03
()11.78
8.00
3.50
17.00
()18.12
10.97
3.50
()6.30
35.21
25.50
40.71
25.70
0.00
25.70
23.81
0.00
37.31
R3.50
B
C
B
C
()15.83
()13.75
()10.50
()47.50
TOP SIDE VIEW
TOP SIDE PCB ILM MOUNTING HOLES
TOP SIDE PCB ILM SILKSCREEN
DETAIL A
5
FINGER ACCESS
COMPONENT KEEPOUT AREA
PIN 1
LEVER UNLATCHED
ADD SILKSCREEN OUTLINE ON PCB PRIMARY SIDE AS SHOWN
Summary of Contents for i5-700
Page 30: ...Independent Loading Mechanism ILM 30 Thermal Mechanical Specifications and Design Guidelines...
Page 88: ...Mechanical Drawings 88 Thermal Mechanical Specifications and Design Guidelines...
Page 94: ...Socket Mechanical Drawings 94 Thermal Mechanical Specifications and Design Guidelines...
Page 98: ...Package Mechanical Drawings 98 Thermal Mechanical Specifications and Design Guidelines...
Page 102: ...Heat Sink Back Plate Drawings 102 Thermal Mechanical Specifications and Design Guidelines...
