LGA1156 Socket
20
Thermal/Mechanical Specifications and Design Guidelines
3.2
Attachment to Motherboard
The socket is attached to the motherboard by 1156 solder balls. There are no additional
external methods (that is, screw, extra solder, adhesive, etc.) to attach the socket.
As indicated in
, the Independent Loading Mechanism (ILM) is not present
during the attach (reflow) process.
3.3
Socket Components
The socket has two main components, the socket body and Pick and Place (PnP) cover,
and is delivered as a single integral assembly. Refer to
for detailed
drawings.
3.3.1
Socket Body Housing
The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable
of withstanding 260 °C for 40 seconds, which is compatible with typical reflow/rework
profiles. The socket coefficient of thermal expansion (in the XY plane), and creep
properties, must be such that the integrity of the socket is maintained for the
conditions listed in
The color of the housing will be dark as compared to the solder balls to provide the
contrast needed for pick and place vision systems.
Figure 3-4. Attachment to Motherboard
Load plate
Frame
Load Lever
Back Plate
Shoulder
Screw
Load plate
Frame
Load Lever
Back Plate
Shoulder
Screw
Summary of Contents for i5-700
Page 30: ...Independent Loading Mechanism ILM 30 Thermal Mechanical Specifications and Design Guidelines...
Page 88: ...Mechanical Drawings 88 Thermal Mechanical Specifications and Design Guidelines...
Page 94: ...Socket Mechanical Drawings 94 Thermal Mechanical Specifications and Design Guidelines...
Page 98: ...Package Mechanical Drawings 98 Thermal Mechanical Specifications and Design Guidelines...
Page 102: ...Heat Sink Back Plate Drawings 102 Thermal Mechanical Specifications and Design Guidelines...
