Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011 Specifications Download

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Document Number #: 324644-002

2nd Generation Intel

Core™

Processor Family Desktop and

LGA1155 Socket

Thermal Mechanical Specifications and Design Guidelines (TMSDG)

Supporting the Intel

Core™ i7, i5 and i3 Desktop Processor

January 2011

Summary of Contents for 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011

Page 1: ...r 324644 002 2nd Generation Intel Core Processor Family Desktop and LGA1155 Socket Thermal Mechanical Specifications and Design Guidelines TMSDG Supporting the Intel Core i7 i5 and i3 Desktop Processo...

Page 2: ...m The processor and Intel Series 6 Chipset and LGA1155 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characte...

Page 3: ...Socket Body Housing 23 3 3 2 Solder Balls 23 3 3 3 Contacts 23 3 3 4 Pick and Place Cover 23 3 4 Package Installation Removal 24 3 4 1 Socket Standoffs and Package Seating Plane 25 3 5 Durability 25...

Page 4: ...59 6 4 3 Power Plane Control 60 6 4 4 Turbo Time Parameter 60 7 PECI Interface 61 7 1 Platform Environment Control Interface PECI 61 7 1 1 Introduction 61 7 1 1 1 Fan Speed Control with Digital Therm...

Page 5: ...essor Cooling Requirements 98 11 4 2 Variable Speed Fan 100 Figures 2 1 Processor Package Assembly Sketch 13 2 2 Package View 14 2 3 Processor Top Side Markings 16 2 4 Processor Package Lands Coordina...

Page 6: ...Fan Speed Control Options 76 9 1 ATX Heatsink Reference Design Assembly 80 9 2 ATX KOZ 3 D Model Primary Top Side 81 9 3 RCBFH Extrusion 82 9 4 Clip for Existing Solutions to straddle LGA1155 Socket...

Page 7: ...Series Quad Core 45W 46 6 5 Thermal Test Vehicle Thermal Profile for Intel Core i5 2000 and i3 2000 Desktop Processor Series Dual Core 35W 47 6 6 Thermal Solution Performance above TCONTROL for the I...

Page 8: ...8 Thermal Mechanical Specifications and Design Guidelines Revision History Revision Number Description Revision Date 001 Initial release January 2011 002 Minor edits for clarity January 2011...

Page 9: ...t Loading Mechanism ILM and back plate The reference design thermal solution heatsink for the processors and associated retention hardware The Intel Core i7 2000 i5 2000 and i3 2000 desktop processor...

Page 10: ...ns interface with the processor at the IHS surface ILM Independent Loading Mechanism provides the force needed to seat the 1155 LGA land package onto the socket contacts PCH Platform Controller Hub Th...

Page 11: ...ase temperature specification of the TTV at a given power level TIM Thermal Interface Material The thermally conductive compound between the heatsink and the processor case This material fills the air...

Page 12: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...

Page 13: ...as the mating surface for processor thermal solutions such as a heatsink Figure 2 1 shows a sketch of the processor package components and how they are assembled together Refer to Chapter 3 and Chapt...

Page 14: ...ut dimensions 5 Reference datums 6 All drawing dimensions are in mm 2 1 2 Processor Component Keep Out Zones The processor may contain components on the substrate that define component keep out zone r...

Page 15: ...age Handling Guidelines Table 2 2 includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate These package handling lo...

Page 16: ...the processor Table 2 3 Processor Materials Component Material Integrated Heat Spreader IHS Nickel Plated Copper Substrate Fiber Reinforced Resin Substrate Lands Gold Plated Copper Figure 2 3 Process...

Page 17: ...rdinates Figure 2 4 shows the bottom view of the processor package Figure 2 4 Processor Package Lands Coordinates AY AV AT AP AM AK AH AF AD AB Y V T P M K H F D B AW AU AR AN AL AJ AG AE AC AA W U N...

Page 18: ...example only Non Operating Temperature Limit 40 C to 70 C Humidity 50 to 90 non condensing with a maximum wet bulb of 28 C Post board attach storage temperature limits are not specified for non Intel...

Page 19: ...surface mounting on the motherboard The contacts are arranged in two opposing L shaped patterns within the grid array The grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the arra...

Page 20: ...0 9144 mm 36 mil in the x direction and 3 114 mm 122 6 mil in the y direction see Figure 3 3 This was to achieve a common package land to PCB land offset which ensures a single PCB layout for socket d...

Page 21: ...AN AR AU AW B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY 1 3 7 5 9 11 15 13 17 19 23 21 25 27 29 2 8 4 6 10 16 12 14 18 24 20 22 26 28 30 32 15 11 14 12 13 16 17 23 19 18 22 20 21 24 25 31 27 26...

Page 22: ...The socket is attached to the motherboard by 1155 solder balls There are no additional external methods that is screw extra solder adhesive and so on to attach the socket As indicated in Figure 3 1 th...

Page 23: ...Ag content between 3 and 4 and a melting temperature of approximately 217 C The alloy is compatible with immersion silver ImAg and Organic Solderability Protectant OSP motherboard surface finishes and...

Page 24: ...tion with the socket 3 4 Package Installation Removal As indicated in Figure 3 7 access is provided to facilitate manual installation and removal of the package To assist in package orientation and al...

Page 25: ...sor insertion and removal The max chain contact resistance from Table 5 4 must be met when mated in the 1st and 20th cycles The socket Pick and Place cover must withstand 15 cycles of insertion and re...

Page 26: ...actuation must meet or exceed SEMI S8 95 Safety Guidelines for Ergonomics Human Factors Engineering of Semiconductor Manufacturing Equipment example Table R2 7 Maximum Grip Forces The socket must be...

Page 27: ...a T 20 Torx head fastener The Torx head fastener was chosen to ensure end users do not inadvertently remove the ILM assembly and for consistency with the LGA1366 socket ILM The Torx head fastener is a...

Page 28: ...desktop back plate and screws have been implemented For ILM back plate three levels of differentiation have been implemented Unique part numbers please refer to part numbers listed in Appendix A Desk...

Page 29: ...32 thread shoulder screw drawing The standard fasteners can be sourced locally The design assumes this fastener has a minimum yield strength of 235 MPa Please refer to Figure B 14 for the standard 6...

Page 30: ...herboard is aligned with the fixture 2 Install the shoulder screw in the single hole near Pin 1 of the socket Torque to a minimum and recommended 8 inch pounds but not to exceed 10 inch pounds 3 Align...

Page 31: ...e 4 5 the shoulder screw socket protrusion and ILM key features prevent 180 degree rotation of ILM cover assembly with respect to socket The result is a specific Pin 1 orientation with respect to ILM...

Page 32: ...rent vendors The tests would include manufacturability bake and thermal cycling See Appendix A for vendor part numbers that were tested Note ILMs that are not compliant to the Intel controlled ILM dra...

Page 33: ...to the motherboard The ILM will be offered with the ILM Cover pre assembled as well as offered as a discrete component ILM Cover features Pre assembled by the ILM vendors to the ILM load plate It wil...

Page 34: ...motherboard After assembly the pick and place cover is removed the ILM Cover installed and the ILM mechanism closed The ILM Cover is designed to pop off if the pick and place cover is accidentally lef...

Page 35: ...cover cannot remain in place and used in conjunction with the ILM Cover The ILM Cover is designed to interfere and pop off if the pick and place cover is unintentionally left in place The ILM cover wi...

Page 36: ...Independent Loading Mechanism ILM 36 Thermal Mechanical Specifications and Design Guidelines...

Page 37: ...d be derived from a the height of the socket seating plane above the motherboard after reflow given in Appendix C b the height of the package from the package seating plane to the top of the IHS and a...

Page 38: ...atic load requirement 6 Test condition used a heatsink mass of 500gm 1 102 lb with 50 g acceleration table input and an assumed 2X Dynamic Acceleration Factor DAF The dynamic portion of this specifica...

Page 39: ...socket Socket Average Contact Resistance EOL 19 mOhm The socket average contact resistance target is calculated from the following equation sum Ni X LLCRi sum Ni LLCRi is the chain resistance defined...

Page 40: ...ased reliability evaluation methodology which is acceleration factor dependent A simplified process flow of this methodology can be seen in Figure 5 1 A detailed description of this methodology can be...

Page 41: ...Selection of the appropriate fan speed is based on the relative temperature data reported by the processor s Digital Temperature Sensor DTS The DTS can be read via the Platform Environment Control In...

Page 42: ...is not the maximum power that the processor can dissipate TDP is measured at DTS 1 TDP is achieved with the Memory configured for DDR3 1333 and 2 DIMMs per channel 6 Specified by design characterizati...

Page 43: ...system and environmental implementation details Figure 6 1 Thermal Test Vehicle Thermal Profile for Intel Core i7 2000 and i5 2000 Desktop Processor Series Quad Core 95W Table 6 2 Thermal Test Vehicl...

Page 44: ...tal implementation details 22 51 5 72 66 0 24 52 1 74 66 6 26 52 6 76 67 1 28 53 2 78 67 7 30 53 8 80 68 3 32 54 4 82 68 9 34 55 0 84 69 5 36 55 5 86 70 0 38 56 1 88 70 6 40 56 7 90 71 2 42 57 3 92 71...

Page 45: ...d Core 65W and Intel Core i3 2000 Desktop Processor Series Dual Core 65W Power W TCASE_MAX C Power W TCASE_MAX C 0 44 4 34 57 3 2 45 2 36 58 1 4 45 9 38 58 8 6 46 7 40 59 6 8 47 4 42 60 4 10 48 2 44 6...

Page 46: ...ystem and environmental implementation details Figure 6 3 Thermal Test Vehicle Thermal Profile for Intel Core i5 2000 Desktop Processor Series Quad Core 45W Table 6 4 Thermal Test Vehicle Thermal Prof...

Page 47: ...apter 10 for system and environmental implementation details Figure 6 4 Thermal Test Vehicle Thermal Profile for Intel Core i5 2000 and i3 2000 Desktop Processor Series Dual Core 35W Table 6 5 Thermal...

Page 48: ...600 series Dual Core 65W Table 6 8 for the Intel Core i5 2000 desktop processor series Quad Core 45W and Table 6 9 for the Intel Core i5 2000 and i3 2000 desktop processor series Dual Core 35W To get...

Page 49: ...22 0 0 709 0 533 21 0 0 727 0 543 20 0 0 746 0 554 Table 6 6 Thermal Solution Performance above TCONTROL for the Intel Core i7 2000 and i5 2000 Desktop Processor Series Quad Core 95W Sheet 2 of 2 TAM...

Page 50: ...ble 6 8 Thermal Solution Performance above TCONTROL for the Intel Core i5 2000 Desktop Processor Series Quad Core 45W TAMBIENT 1 CA at DTS TCONTROL 2 CA at DTS 13 48 2 0 480 0 480 47 0 0 525 0 507 46...

Page 51: ...9 Thermal Solution Performance above TCONTROL for the Intel Core i5 2000 and i3 2000 Desktop Processor Series Dual Core 35W TAMBIENT 1 CA at DTS TCONTROL 2 CA at DTS 13 48 2 0 480 0 480 47 0 0 538 0 5...

Page 52: ...rements should be made See Figure B 12 for drawing showing the thermocouple attach to the TTV package Note The following supplier can machine the groove and attach a thermocouple to the IHS The suppli...

Page 53: ...S is not required to select a specific method as with previous generation processors supporting TM1 or TM2 The temperature at which Adaptive Thermal Monitor activates the Thermal Control Circuit is fa...

Page 54: ...ter 1ms the processor is still too hot the temperature has not dropped below the TCC activation point DTS still 0 and PROCHOT is still active then a second frequency and voltage transition will take p...

Page 55: ...mperature Once the temperature has dropped below the maximum operating temperature and the hysteresis timer has expired the TCC goes inactive and clock modulation ceases 6 2 2 3 Immediate Transition t...

Page 56: ...r it can be driven from an external source such as a voltage regulator to activate the TCC The ability to activate the TCC via PROCHOT can provide a means for thermal protection of system components A...

Page 57: ...nology may not be available on all SKUs 6 3 1 Intel Turbo Boost Technology Frequency The processor s rated frequency assumes that all execution cores are running an application at the Thermal Design P...

Page 58: ...and adjust the turbo frequency to maintain the average power within limits over a thermally significant time period The package processor core and graphic core powers are estimated using architectural...

Page 59: ...ized workload or power virus application were to result in exceeding programmed power limits the processor Thermal Control Circuitry TCC will protect the processor when properly enabled Adaptive Therm...

Page 60: ...all usages This function is similar to the package level long duration window control 6 4 4 Turbo Time Parameter Turbo Time Parameter is a mathematical parameter units in seconds that controls the pro...

Page 61: ...o 2 Mbps CRC check byte used to efficiently and atomically confirm accurate data delivery Synchronization at the beginning of every message minimizes device timing accuracy requirements For desktop te...

Page 62: ...PECI Interface 62 Thermal Mechanical Specifications and Design Guidelines...

Page 63: ...pecification that meets the following requirements Use Digital Thermal Sensor DTS for real time thermal specification compliance Single point of reference for thermal specification compliance over all...

Page 64: ...versus Sensor Based Specification Power Sensor Based Specification DTS Temp TDP Tcontrol Ta 30 C ca 0 564 ca 0 448 Power Current Specification Case Temp TDP Tcontrol Ta 45 1 C Ta 30 C ca 0 292 Power S...

Page 65: ...on will not require the user to apply a thermocouple to the processor package or measure processor power Note All functional compliance testing will be based on fan speed response to the reported DTS...

Page 66: ...quired CA which means lower fan speeds and reduced acoustics from the processor thermal solution In the prior thermal specifications this region DTS values greater than TCONTROL was defined by the pro...

Page 67: ...gner can select a TAMBIENT and CA to use in thermal modelling The assumption of a TAMBIENT has a significant impact on the required CA needed to meet TTV TCASEMAX at TDP A system that can deliver lowe...

Page 68: ...nal step in thermal solution validation is to establish the thermal solution performance CA and acoustics as a function of fan speed This data is necessary to allow the fan speed control algorithm dev...

Page 69: ...s RPM to achieve the necessary level of cooling DTS 1 1 provides another option to do fan speed control without the Tambient data Please refer to Section 8 4 3 for more details This chapter will discu...

Page 70: ...g assumptions are made TAMBIENT 40 C Thermal Solution designed validated to a 40 C environment TCONTROL 20 Reference processor thermal solution RCFH7 1156 DHA A Below TCONTROL the fan speed is slowed...

Page 71: ...lates into acoustic margin that can be used in the overall system acoustic budget In this example the following assumptions are made TAMBIENT 35 C The same Thermal Solution designed validated to a 40...

Page 72: ...even if the assumption is a TAMBIENT 35 C This is graphically displayed in Figure 8 7 The shaded area displayed in Figure 8 7 is where DTS values are less than TCONTROL For simplicity the graph shows...

Page 73: ...ple for a 95 TDP part the Tcase max is 72 6C and at a worst case design point of 40C local ambient this will result in CA 72 6 40 95 0 34 C W Similarly for a system with a design target of 45 C ambien...

Page 74: ...essor_TDP 2 Example For A Chassis Trise assumption of 12 C for a 95W TDP processor CF 1 7 95W 0 018 C For Trise 10 C CA at Tcontrol Value listed in Column_2 Trise 10 CF CA 0564 12 10 0 018 0 528 C W I...

Page 75: ...hassis that has Trise lower than 10C based on the reference thermal solution data a fan speed of 1050 RPM will give the needed CA at TCONTROL A maximum fan speed of 3150 RPM will be programmed for DTS...

Page 76: ...s desired by other system cooling needs Notes 1 Tj is the CPU temperatuers and can be calulated from relative DTS value PECI and TjMax register Tj DTS TjMax register 8 5 System Validation System valid...

Page 77: ...ations that are representative of the expected end user usage model and verify the following Verify fan speed response versus expectations as done using Power Thermal Utility SW Validate system bounda...

Page 78: ...he testing performed a curve was fit to the data in the form Psi_ca a x RPM3 b x RPM2 c x RPM d where a 1 53 E 11 b 1 41 E 07 c 0 00048 d 0 925782 6 Full Speed of 3150 RPM the DHA A thermal solution d...

Page 79: ...ting the Intel Core i7 2000 and i5 2000 desktop processor series Quad Core 95W The second is called the RCFH6 1156 DHA B which only supports the Intel Core i7 2000 and i5 2000 desktop processor series...

Page 80: ...ATX Reference Thermal Solution 80 Thermal Mechanical Specifications and Design Guidelines Figure 9 1 ATX Heatsink Reference Design Assembly...

Page 81: ...The reference solution requires a chassis obstruction height of at least 81 30 mm 3 20 inches measured from the top of the motherboard This allows for appropriate fan inlet airflow to ensure fan perf...

Page 82: ...al TIM The clip does not have to provide additional load for socket solder joint protect The clip is formed from 1 6 mm carbon steel the same material as used in previous clip designs The target metal...

Page 83: ...ting designs The machined flange height will be determined in the preliminary design review to match the IHS height for the processors when installed in the LGA1155 The final height of the flange will...

Page 84: ...design is only intended to adapt previous thermal solutions such as the Intel RCBFH3 Reference Design to comply with the mechanical and structural requirements for the LGA1155 socket If 3rd party coo...

Page 85: ...the Reference Clip Core shoulder traps clip in place Core shoulder traps clip in place Clip Core Fin Array Fan Clip See Detail A Core Fin Array Fan Clip See Detail A Detail A Fin Array Clip Core 1 6 m...

Page 86: ...6 Thermal Interface Material A thermal interface material TIM provides conductivity between the IHS and heat sink The designs use Dow Corning TC 1996 The TIM application is 0 14 g which will be a nomi...

Page 87: ...shows the orientation and position of the 1155 land LGA Package TTV die this is the same package layout as used in the 1156 land LGA Package TTV The TTV die is sized and positioned similar to the prod...

Page 88: ...ATX Reference Thermal Solution 88 Thermal Mechanical Specifications and Design Guidelines...

Page 89: ...arefully evaluate the completed assembly prior to use in high volume Some general recommendations are shown in Table 10 1 The Intel reference heatsinks will be tested in an assembled to the LGA1155 so...

Page 90: ...cessor IHS No visible tilt of the heatsink with respect to the retention hardware 3 No signs of physical damage on baseboard surface due to impact of heatsink 4 No visible physical damage to the proce...

Page 91: ...terials are not fungal growth resistant then MIL STD 810E Method 508 4 must be performed to determine material performance Material used shall not have deformation or degradation in a temperature life...

Page 92: ...Thermal Solution Quality and Reliability Requirements 92 Thermal Mechanical Specifications and Design Guidelines...

Page 93: ...hat manufacture baseboards for system integrators Note Unless otherwise noted all figures in this chapter are dimensioned in millimeters and inches in brackets Figure 11 1 shows a mechanical represent...

Page 94: ...entation of the boxed processor Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling The physical space requirements and dimensions for the boxed processor with...

Page 95: ...ssor Specifications Note Diagram does not show the attached hardware for the clip design and is provided only as a mechanical representation Figure 11 2 Space Requirements for the Boxed Processor side...

Page 96: ...atsink attach clip assembly to secure the processor and fan heatsink in the baseboard socket The boxed processor will ship with the heatsink attach clip assembly 11 3 Electrical Requirements 11 3 1 Fa...

Page 97: ...ader identification and location should be documented in the platform documentation or on the system board itself Figure 11 6 shows the location of the fan power connector relative to the processor so...

Page 98: ...erature within the specifications see Table 6 1 in chassis that provide good thermal management For the boxed processor fan heatsink to operate properly it is critical that the airflow provided to the...

Page 99: ...ications and Design Guidelines 99 Boxed Processor Specifications Figure 11 7 Boxed Processor Fan Heatsink Airspace Keepout Requirements top view Figure 11 8 Boxed Processor Fan Heatsink Airspace Keepo...

Page 100: ...the higher set point is reached At that point the fan speed is at its maximum As fan speed increases so does fan noise levels Systems should be designed to provide adequate air around the boxed proces...

Page 101: ...M control signal to the 4th pin of the connector labeled as CONTROL The fan speed is based on actual processor temperature instead of internal ambient chassis temperatures If the new 4 pin active fan...

Page 102: ...Boxed Processor Specifications 102 Thermal Mechanical Specifications and Design Guidelines...

Page 103: ...post sales support Table A 1 Reference Heatsink Item Intel PN Delta Foxconn Nidec 2011D Heatsink Assembly RCFH7 1156 DHA A E41759 002 DTC DAA07 1A01C7T00 DHA_XA02 F90T12MS1Z7 64A01A1 2011C Heatsink A...

Page 104: ...omponents Co Ltd Kai Chang 86 755 3366 8888 x63588 kai_chang avc com tw Delta William Bradshaw 1 510 668 5570 86 136 8623 1080 WBradshaw delta corp com Foxconn Julia Jiang 1 408 919 6178 juliaj foxcon...

Page 105: ...igure B 2 Socket Processor ILM Keepout Zone Primary Side Top Figure B 3 Socket Processor ILM Keepout Zone Secondary Side Bottom Figure B 4 Reference Design Heatsink Assembly Figure B 5 Reference Faste...

Page 106: ...E DO NOT SCALE DRAWING SHEET 1 OF 2 UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14 5M 1994 DIMENSIONS ARE IN MILLIMETERS THIRD ANGLE PROJECTION NOTES 1 DIME...

Page 107: ...0 18 00 18 00 9 36 9 36 27 33 DEPARTMENT R 2200 MISSION COLLEGE BLVD P O BOX 58119 SANTA CLARA CA 95052 8119 SIZE DRAWING NUMBER REV A1 E21319_REV_L_PAE L SCALE 1 000 DO NOT SCALE DRAWING SHEET 2 OF 2...

Page 108: ...R CPU PACKAGE ALIGNS WITH DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP INS 2 SOCKET KEEP IN VOLUME VERTICAL HEIGHT ESTABLISHES LIMIT OF SOCKET AND CPU PACKAGE ASSEMBLY IN THE SOCKET LOCKED DOWN POSI...

Page 109: ...X 4 70 NO ROUTE ON ALL OTHER LAYERS COPPER PAD ON PRIMARY SIDE NON GROUNDED COPPER PAD CAN INSET MAXIMUM OF 127MM FROM THE NO ROUTE EDGE 6 00 0 05 0 03 3X NPTH 3 80 0 05 0 03 11 78 8 00 3 50 17 00 18...

Page 110: ...Mechanical Drawings 110 Thermal Mechanical Specifications and Design Guidelines Figure B 5 Reference Design Heatsink Assembly...

Page 111: ...Thermal Mechanical Specifications and Design Guidelines 111 Mechanical Drawings Figure B 6 Reference Fastener Sheet 1 of 4...

Page 112: ...Mechanical Drawings 112 Thermal Mechanical Specifications and Design Guidelines Figure B 7 Reference Fastener Sheet 2 of 4...

Page 113: ...Thermal Mechanical Specifications and Design Guidelines 113 Mechanical Drawings Figure B 8 Reference Fastener Sheet 3 of 4...

Page 114: ...Mechanical Drawings 114 Thermal Mechanical Specifications and Design Guidelines Figure B 9 Reference Fastener Sheet 4 of 4...

Page 115: ...2 1 333 007 A 1 60 063 NOTES 1 THIS DRAWING TO BE USED IN CONJUNTION WITH SUPPLIED 3D DATABASE FILE ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE APPLICABLE...

Page 116: ...30 D REV DRAWING NUMBER SIZE DEPARTMENT E36830 2 01 DWG NO SHT REV R TYP 0 3 0118 7 34 289 R1 4 055 R3 1 122 43 1 3 57 141 5 3 2087 7 35 2894 2X R3 6 1417 1 65 065 135 1 06 042 2X R0 5 0197 R MIN 0 45...

Page 117: ...L IS NICKEL PLATED COPPER 5 CUT DIRECTION ORIENTATION OF GROOVE IS AS SHOWN 6 ALL MACHINED EDGES ARE TO BE FREE OF BURRS 7 THE 0 0150 DEPTH AT THE PACKAGE CENTER IS CRITICAL 4 A 3 PROJECTION MATERIAL...

Page 118: ...Mechanical Drawings 118 Thermal Mechanical Specifications and Design Guidelines Figure B 13 ILM Shoulder Screw...

Page 119: ...Thermal Mechanical Specifications and Design Guidelines 119 Mechanical Drawings Figure B 14 ILM Standard 6 32 Thread Fastener...

Page 120: ...Mechanical Drawings 120 Thermal Mechanical Specifications and Design Guidelines...

Page 121: ...lists the mechanical drawings included in this appendix Table C 1 Mechanical Drawing List Drawing Description Figure Number Socket Mechanical Drawing Sheet 1 of 4 Figure C 1 Socket Mechanical Drawing...

Page 122: ...Socket Mechanical Drawings 122 Thermal Mechanical Specifications and Design Guidelines Figure C 1 Socket Mechanical Drawing Sheet 1 of 4...

Page 123: ...Thermal Mechanical Specifications and Design Guidelines 123 Socket Mechanical Drawings Figure C 2 Socket Mechanical Drawing Sheet 2 of 4...

Page 124: ...Socket Mechanical Drawings 124 Thermal Mechanical Specifications and Design Guidelines Figure C 3 Socket Mechanical Drawing Sheet 3 of 4...

Page 125: ...Thermal Mechanical Specifications and Design Guidelines 125 Socket Mechanical Drawings Figure C 4 Socket Mechanical Drawing Sheet 4 of 4...

Page 126: ...Socket Mechanical Drawings 126 Thermal Mechanical Specifications and Design Guidelines...

Page 127: ...cal Drawings D Package Mechanical Drawings Table D 1 lists the mechanical drawings included in this appendix Table D 1 Mechanical Drawing List Drawing Description Figure Number Processor Package Drawi...

Page 128: ...Package Mechanical Drawings 128 Thermal Mechanical Specifications and Design Guidelines Figure D 1 Processor Package Drawing Sheet 1 of 2...

Page 129: ...Thermal Mechanical Specifications and Design Guidelines 129 Package Mechanical Drawings Figure D 2 Processor Package Drawing Sheet 2of 2...

Page 130: ...Package Mechanical Drawings 130 Thermal Mechanical Specifications and Design Guidelines...

Page 131: ...any representations or warranties whatsoever regarding quality reliability functionality or compatibility of these devices Customers are responsible for thermal mechanical and environmental validatio...

Page 132: ...DO NOT SCALE DRAWING SHEET 1 OF 1 NOTES 1 SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC CENTER OF SOCKET HOUSING CAVITY FOR CPU PACKAGE ALIGNS WITH DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP...

Page 133: ...Thermal Mechanical Specifications and Design Guidelines 133 Heat Sink Back Plate Drawings Figure E 2 Heat Sink Back Plate...

Page 134: ...K SHIMADA DATE DRAWN BY 12 17 07 R AOKI DATE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14 5M 1994 DIMENSIONS ARE IN MILLIMETERS ALL UNTOLERANC...

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