IBM 7012 G Series, Service Manual

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Glossary
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Glossary: Special Terms Used in SystemGuard
BP (back plane). A panel located in the system
unit and used to interconnect boards and devices.
BIST (built in self-test). Tests performed during
the standby phase of the IPL process. The BIST
phase comes ahead of the POST phase.
BUMP (bring-up microprocessor). A
microprocessor which monitors the system,
especially during the various IPL phases before
AIX is loaded.
C1D card. See CPU card.
CPU card. A card containing the central processor
unit (CPU). CPU
n is used to designate the nth CPU
card. For example, CPU2 designates the second
CPU card.
CPU (central processor unit). A primary
processor for general calculations.
DIMM (dual in-line memory module). See
memory module.
Electronic Mode Switch (also known as E_KEY).
A flag which enables the Key Mode Switch to be
changed without actually moving the physical key.
EEPROM (electronically erasable
programmable read-only memory). A type of
non-volatile memory used to store firmware
maintenance programs (like SSF) or boot
programs.
FEPROM (flash electronically erasable
programmable read-only memory). A type of
non-volatile memory used to store firmware
maintenance programs (like SystemGuard) or IPL
programs.
E_KEY. See Electronic Mode Switch.
ELM. See I/O planar
FFC (failing function code).
FRU (field replaceable unit).
I2C (inter integrated circuit). Special circuits used
to connect devices to a high-speed bus called the
I2C bus.
IOD. See I/O card.
I/O: Input /Output.
I/O card. A card which handles system I/O and
directly connects to the system planar.
IPL (initial program load). The first phase of the
system program loading.
JTAG (join test action group).
LCD (liquid crystal display). A low power display
screen. There is a small LCD screen on the
operator panel.
MCA (Micro Channel adapter). An adapter for the
micro channel bus.
MCA Planar. A card with connectors for Micro
Channel adapter cards.
Memory Module. A card containing one (SIMM) or
two (DIMM) rows of memory chips.
MPE. A type of memory card.
MR2. A memory card with 8 8MB memory
modules.
MR4. A memory card with 8 32MB memory
modules.
MVR (multivoltage regulator). A power supply
unit which regulates several voltage levels for
various system parts (disks, CPUs, memory chips).
NFx. A type of memory card.
NVRAM (non volatile random access memory).
MP. The MCA planar located in the base unit.
MPB. See System planar.
MPe. The MCA planar located in the expansion
unit.
PMA. See MP.
PME. See MPe.
POS (programmable option select). POS
registers are used to specify MCA board options.
POST (power-on self-test). Tests performed
during the initial phase of the program load
process. The BIST phase comes ahead of the
POST phase.
RDS (removable disk status). The status
information for a removable disk drive (a disk drive