4
WFS 101545 Operations Manual
SECTION I OVERVIEW
1)
NOMENCLATURE
NOTE: This message highlights a feature, function or procedure that may be helpful.
CAUTION:
This message warns of a condition that may have unintended negative action or
consequences. It indicates a need for heightened diligence.
WARNING:
This message warns of a condition or procedure that has potential for physical
injury or death. Often it is applied to a procedure that requires special equipment or qualified
personnel.
This symbol warns of a potential shock hazard that may cause injury or death.
Images and Illustrations
Each unit is hand built to order and may have slight variations from the images depicted in this
manual. Additionally, some images used are of a generic assembly and may not depict certain
optional equipment that is included on any particular unit.
Application
This manual is for use with WFS 101545 with serial numbers 210610 and higher. The
procedures described herein are for a generic installation and commissioning. The conditions
vary from one facility to another and procedures outlined herein may require modification to
accommodate specific facility requirements.
2)
GENERAL DESCRIPTION
The WFS 101545 filtration system was specifically engineered to provide temperature-
controlled water for wafer dicing and similar processes. The system permits re-use of process
and cooling water used for dicing or grinding semiconductor wafers. The WFS 101545 provides
complete water conditioning packaged on a compact rigid skid. The valving and redundant
features allow for change out of filter elements and resin beds without process interruption.
The unit provides the following water conditioning:
Cooling by refrigeration
Filtration
Deionization
1
Although specifically designed for the semiconductor industry the unit can be applied to any
process that requires refrigerated, filtered and deionized water.
1
Deionization is accomplished by customer supplied resin beds. The unit provides valving and space for three 14”
diameter resin beds.
