16
IC695CPE400 Rackless CPU Quick Start Guide
GFK-3002G
Figure 3: Thermal Spacing Requirements
50mm
50mm
100
mm
100
mm
Air flow
ad
ja
cen
t
d
ev
ic
e
ri
ght
ad
ja
cen
t
d
ev
ic
e
lef
t
adjacent device below
adjacent device above
25mm
Air flow
max. 70°C
Figure 4: Mounting on DIN
Rail
Figure 5: Dismounting
from DIN Rail