10
•
Z-Trak2 2K Series common specifications
Z-Trak2 3D Profiler Sensors
General
Description
Status Indicators
3 LED indicators:
•
Status: functional and connection status
•
Laser: when ON, laser is ready
•
Range: TBD
Exposure Modes
Single or Continuous
Programmable in increments of 1 µs (minimum 20 µs)
Trigger Events support
External Trigger source, Trigger Ignored count
Exposure Control
Internal
–
Programmable via the profiler API
External
–
based on Trigger Width
Exposure Time Maximum
16 sec
Trigger Inputs
Opto-Isolated
Debounce range from 0 up to 255 µs with selectable edge or level active
Programmable Trigger Delay
Shaft Encoder Input
Differential input RS422 and single-ended TTL, max frequency 5 MHz
Laser Power Auto Mode
Manual or Automatic
Counter and Timer
1 Counter and 1 Timer. User programmable, acquisition independent, with event
generation and output pin control
User settings
2 user sets and factory set. User selectable power-up configurations
Mechanical Interface
Enclosures (L x H x W)
See details in section Mechanical specifications
Enclosure IP rating
Conform to IP67 Protection Level (IEC)
Power connection
Via I/O connector or via Ethernet cable with PoE injector
I/O M12 17-pin male, Ethernet M12 X-coded 8-pin female
Electrical Interface
Power input voltage
Aux. power input: +20 to +24 V DC, max = 30 V
PoE injector: Supports IEEE 802.3at PoE type 2 (PoE+), max voltage = 57 V DC
Input/outputs
2 inputs, configurable as triggers or general-purpose input (max freq. 50 kHz)
2 outputs, configurable as general output (max. freq. TBD)
Power dissipation (typical)
5GigE:
24 V aux. power input: 14 W
PoE+: 17 W
1GigE:
24 V aux. power input: 13.5 W
PoE+: 16 W
Data output
5/2.5/1 GigE (S-Series), 1 GigE (V-Series) (10/100 Mbps not supported)
Data and control
GigE Vision 2.0 compliant, GenICam 3.0, SFNC 2.3
Environmental Conditions
Conformity
IP67, FDA (pending), ICE (pending), CE (pending), FCC (pending), GenICam
(pending), GigE Vision (pending), IEEE 802.3af (PoE) (pending)
Operating temperature (front plate)
10
o
C to 50
o
C (50
o
F to 122
o
F) at up to 90% relative humidity (non-condensing)
Heat conducting metallic mounting used as heat-sink important for reducing device
temperature
Storage
-40
o
C to 80
o
C (-4
o
F to 176
o
F) at 20% to 80% relative humidity (non-condensing)