BGS3 Hardware Interface Description
Contents
BGS3_HD_v01.000d
Page 5 of 109
2010-03-26
Confidential / Released
Mounting BGS3 onto the Application Platform................................................. 93
6.2.1
Land Pattern and Stencil ..................................................... 93
Board Level Characterization.............................................. 94
Moisture Sensitivity Level ................................................................... 95
Soldering Conditions and Temperature .............................................. 95
6.2.3.1
Reflow Profile ...................................................................... 95
Maximum Temperature and Duration.................................. 96
Durability and Mechanical Handling.................................................... 97
6.2.4.1
Storage Life ......................................................................... 97
Processing Life.................................................................... 97
Baking ................................................................................. 97
Electrostatic Discharge........................................................ 97
Orientation........................................................................... 98
Barcode Label ..................................................................... 99
Moisture Barrier Bag ......................................................... 100
Transportation Box ............................................................ 102
Reference Equipment for Type Approval....................................................... 105
Compliance with FCC and IC Rules and Regulations ................................... 106