Cinterion BGS3, Hardware Interface Description

Page: 72 / 109

BGS3 Hardware Interface Description
5.5 Pad Assignment and Signal Description
90
BGS3_HD_v01.000d Page 72 of 109 2010-03-26
Confidential / Released

5.5 Pad Assignment and Signal Description
The SMT application interface on the BGS3 provides connecting pads to integrate the module
into external applications.
Figure 33 shows the connecting pads’ numbering plan, the following
Table 26 lists the pads’ assignments.
Figure 33:
Numbering plan for connecting pads (bottom view)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
41
42
43
37
38
39
40
45
46
47
51
52
53
57
58
59
48
49
50
54
55
56
60
61
62
63
64
65
69
70
71
75
76
77
66
67
68
72
73
74
80
81
82
85
86
87
88
89
90
91
92
93
94
98
99
100
101
102
103
104
105
106
107
109
110
111
112
113
114
115
116
117
118
83
84 97
95
96
108
78
79
119
44
Supply pads
Control pads
GND pads
Analog audio pads
ASC0 pads
ASC1 pads
SIM pads
Digital audio pads
RF antenna pad
Do not use