BGS3 Hardware Interface Description
2.1 Key Features at a Glance
21
BGS3_HD_v01.000d
Page 19 of 109
2010-03-26
Confidential / Released
Software
AT commands
Hayes 3GPP TS 27.007, TS 27.005, Cinterion
AT commands for RIL compatibility
Microsoft
TM
compatibility RIL for Pocket PC and Smartphone
SIM Application Toolkit
SAT Release 99
TCP/IP stack
Access by AT commands
Firmware update
Generic update from host application over ASC0 or ASC1.
Interfaces
Module interface
Surface mount device with solderable connection pads (SMT application
interface).
Land grid array (LGA) technology ensures high solder joint reliability and
provides the possibility to use an optional module mounting socket.
For more information on how to integrate SMT modules see also
application note comprises chapters on module mounting and application
layout issues as well as on additional SMT application development equip-
ment.
2 serial interfaces
ASC0:
•
8-wire modem interface with status and control lines, unbalanced, asyn-
chronous
•
Adjustable baud rates: 300bps to 921,600bps
•
Autobauding: 1,200bps to
460,800
bps
•
Supports RTS0/CTS0 hardware handshake and software XON/XOFF
flow control.
•
Multiplex ability according to GSM 07.10 Multiplexer Protocol.
ASC1:
•
4-wire, unbalanced asynchronous interface
•
Adjustable baud rates: 300bps to 921,600bps
•
Supports RTS1/CTS1 hardware handshake and software XON/XOFF
flow control
Audio
2 analog interfaces
1 digital interfaces (PCM)
SIM interface
Supported SIM cards: 3V, 1.8V
Antenna
50
Power on/off, Reset
Power on/off
Switch-on by hardware signal IGT
Switch-off by AT command (AT^SMSO)
Automatic switch-off in case of critical temperature and voltage conditions.
Reset
Orderly shutdown and reset by AT command
Emergency reset by hardware signals EMERG_OFF and IGT.
Special features
Charging
Supports management of rechargeable Lithium Ion and Lithium Polymer
batteries
Real time clock
Timer functions via AT commands
Phonebook
SIM and phone
TTY/CTM support
Integrated CTM modem
Feature
Implementation
