BGS3 Hardware Interface Description
5.5 Pad Assignment and Signal Description
90
BGS3_HD_v01.000d
Page 78 of 109
2010-03-26
Confidential / Released
SIM
interface
specified
for use
with 1.8V
SIM card
CCIN
I
R
I
100k
V
IL
max = 0.6V at I = -25µA
V
IH
min = 2.1V at I = -10µA
V
O
max = 3.05V
CCIN = Low, SIM card holder
closed
Maximum cable length or cop-
per track 100mm to SIM card
holder.
All signals of SIM interface are
protected against ESD with a
special diode array.
Usage of CCGND is manda-
tory.
CCRST
O
R
O
47
V
OL
max = 0.25V at I = +1mA
V
OH
min = 1.45V at I = -0.5mA
V
OH
max = 1.90V
CCIO
I/O R
I
4.7k
V
IL
max = 0.45V
V
IH
min = 1.35V
V
IH
max = CC 0.3V
=2.00V
R
O
100
V
OL
max = 0.3V at I = +1mA
V
OH
min = 1.45V at I = -0.5mA
V
OH
max = 1.90V
CCCLK
O
R
O
100
V
OL
max = 0.3V at I = +1mA
V
OH
min = 1.45V at I = -0.5mA
V
OH
max = 1.90V
CCVCC
O
V
O
min = 1.70V,
V
O
typ = 1.80V
V
O
max = 1.90V
I
O
max = -20mA
CCGND
Ground
Digital
Audio
interface
DAI0 O
V
OL
max = 0.2V at I = 2mA
V
OH
min = 2.55V at I = -0.5mA
V
OH
max = 3.00V
V
IL
max = 0.8V
V
IH
min = 2.15V
V
IH
max = V 0.3V = 3.05V
See
for details.
Unused input lines should be
tied to GND via pull down resis-
tors. DAI1 requires a 47kOhm
pull down resistor to be placed
as close as possible to the mod-
ule. Unused output lines must
be left open.
DAI1 I
DAI2 O
DAI3 O
DAI4 I
DAI5 I
DAI6 I
Table 27:
Signal description
(Continued)
Function
Signal name
IO
Signal form and level
Comment
