BGS3 Hardware Interface Description
6.2 Mounting BGS3 onto the Application Platform
102
BGS3_HD_v01.000d
Page 96 of 109
2010-03-26
Confidential / Released
6.2.3.2
Maximum Temperature and Duration
The following limits are recommended for the SMT board-level soldering process to attach the
module:
•
A maximum module temperature of 245°C. This specifies the temperature as measured at
the module’s top side.
•
A maximum duration of 30 seconds at this temperature.
Please note that while the solder paste manufacturers' recommendations for best temperature
and duration for solder reflow should generally be followed, the limits listed above must not be
exceeded.
BGS3 is specified for one soldering cycle only. Once BGS3 is removed from the application,
the module will very likely be destroyed and cannot be soldered onto another application.
Table 37:
Reflow temperature ratings
Profile Feature
Pb-Free Assembly
Preheat & Soak
Temperature Minimum (T
Smin
)
Temperature Maximum (T
Smax
)
Time (t
Smin
to t
Smax
) (t
S
)
150°C
200°C
60-120 seconds
Average ramp up rate (T
Smax
to T
P
)
3K/second max.
Liquidous temperature (T
L
)
Time at liquidous (t
L
)
217°C
60-90 seconds
Peak package body temperature (T
P
)
245°C +0/-5°C
Time (t
P
) within 5 °C of the peak package body
temperature (T
P
)
30 seconds max.
Average ramp-down rate (T
P
to T
Smax
)
6 K/second max.
Time 25°C to maximum temperature
8 minutes max.
