BGS3 Hardware Interface Description
5.9 Electrostatic Discharge
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BGS3_HD_v01.000d
Page 90 of 109
2010-03-26
Confidential / Released
5.9
Electrostatic Discharge
The GSM module is not protected against Electrostatic Discharge (ESD) in general. Conse-
quently, it is subject to ESD handling precautions that typically apply to ESD sensitive compo-
nents. Proper ESD handling and packaging procedures must be applied throughout the
processing, handling and operation of any application that incorporates a BGS3 module.
Special ESD protection provided on BGS3:
•
SIM interface: clamp diodes for protection against overvoltage.
The remaining ports of BGS3 are not accessible to the user of the final product (since they are
installed within the device) and therefore, are only protected according to the "Human Body
Model" requirements.
BGS3 has been tested according to the EN 61000-4-2 standard. The measured values can be
gathered from the following table.
Note: Please note that the values may vary with the individual application design. For example,
it matters whether or not the application platform is grounded over external devices like a com-
puter or other equipment, such as the Cinterion Wireless Modules reference application de-
scribed in
Table 36:
Measured electrostatic values
Specification / Requirements
Contact discharge
Air discharge
ETSI EN 301 489-1/7
SIM interface
±
4kV
±
8kV
JEDEC JESD22-A114D
All other interfaces
±
1kV Human Body Model
n.a.
