LISA-U1 series - System Integration Manual
3G.G2-HW-10002-3
Preliminary
Design-In
Page 94 of 125
Figure 49: Layer 2 (inner layer) of u-blox approved interface board for LISA-U1 series modules
The dielectric thickness (FR4 Laminate 7628) from Layer 2 (inner layer) to Layer 3 (inner layer) is 0.76 mm.
The Layer 3 (inner layer, described in Figure 50) is designed for signals routing and GND plane.
Layer 3 thickness is 0.035 mm.
Figure 50: Layer 3 (inner layer) of u-blox approved interface board for LISA-U1 series modules
The dielectric thickness (FR4 Prepreg 1080) from Layer 3 (inner layer) to Layer 4 (bottom layer) is 0.27 mm.
The Layer 4 (bottom layer, described in Figure 51) is designed for signals routing, components placement and
GND plane.
Layer 4 thickness is 0.035 mm.
