LISA-U1 series - System Integration Manual
3G.G2-HW-10002-3
Preliminary
Handling and soldering
Page 120 of 125
4.2.10
Casting
If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such
processes in combination with the LISA-U1 series modules before implementing this in the production.
Casting will void the warranty.
4.2.11
Grounding metal covers
Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the
EMI covers is done at the customer's own risk. The numerous ground pins should be sufficient to provide
optimum immunity to interferences and noise.
u-blox gives no warranty for damages to the LISA-U1 series modules caused by soldering metal cables or
any other forms of metal strips directly onto the EMI covers.
4.2.12
Use of ultrasonic processes
LISA-U1 series modules contain components which are sensitive to Ultrasonic Waves. Use of any Ultrasonic
Processes (cleaning, welding etc.) may cause damage to the module.
u-blox gives no warranty against damages to the LISA-U1 series modules caused by any Ultrasonic
Processes.