C-1
Themis Computer
C
X9DRi-F Motherboard
This section provides specifications and information regarding the Supermicro™
X9DRi-F motherboard, located in the CPU blade of the CoolShell 3U Generation 2.
C.1
Overview
The X9DRi-F (see
Table C-1
, page C-2; a block diagram is given in
Figure C-2
,
page C-4) is based upon the Dual processor Sandy Bridge-based Xeon chipsets, sup-
porting two Intel® LGA 2011 (socket R) 64-bit E5-2600 V2-Series Xeon™ proces-
sors, each with a QPI (Quick Path Interconnect) up to 8.0 GT/s (Giga-Transfers per
Second) supporting memory up to 1 TB of ECC DDR3 with speeds up to 1866
MHz.
Note:
These are purely X9DRi-F motherboard features. Thus, not all features
may be realized through the CPU blade, or the CoolShell 3U system as a whole.
These specifications and features should serve for informational purposes only.
Appendix
Содержание CoolShell 3U
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Страница 118: ...B 48 Themis Computer CoolShell 3U Generation 2 Installation Manual Version 1 1...
Страница 122: ...C 4 Themis Computer CoolShell 3U Generation 2 Installation Manual Version 1 1 Figure C 2 X9DRi F Block Diagram...
Страница 130: ...C 12 Themis Computer CoolShell 3U Generation 2 Installation Manual Version 1 1...
Страница 156: ...CoolShell 3U Generation 2 Installation Manual Version 1 1 Index 6 Themis Computer...