![Tektronix 434 Скачать руководство пользователя страница 76](http://html1.mh-extra.com/html/tektronix/434/434_instruction-manual_1078892076.webp)
Maintenance—434
C irc u it Boards. Use o rd in a ry 6 0 /4 0 solder and a 35- to
4 0 -w a tt pencil ty p e soldering iro n on th e c irc u it boards.
T he tip o f th e iro n should be clean and p ro p e rly tin n e d fo r
best heat tra n sfe r to the solder jo in t. A higher w attage
soldering iro n m ay separate th e w irin g fro m the base
m a te ria l.
The fo llo w in g te ch n iq u e should be used to replace a
c o m p o n e n t on a c irc u it b o a rd . M o st co m p o n e n ts can be
replaced w it h o u t rem oving th e boards fro m the in s tru m e n t.
>
C A U T I O N i
The V e rtic a l M o d e S w itc h , the a tte n u a to r a n d the
V e rtic a l In p u t A m p lifie r c ir c u it b oards are m ade o f
m a te ria l easily dam aged b y excessive heat. When
so ld e rin g to these boards, d o n o t use a so ld e rin g iro n
w ith a ra tin g o f m o re than a p p ro x im a te ly 15 watts.
A v o id p ro lo n g e d a p p lic a tio n s o f h e a t to c irc u it-b o a rd
connections.
1.
G rip th e c o m p o n e n t lead w ith long-nose pliers.
T o u ch th e soldering iro n to th e lead at the solder connec
tio n . D o n o t lay the iro n d ire c tly on the board as i t may
damage th e board.
2.
When th e solder begins to m e lt, p u ll th e lead o u t
g e n tly . T h is s h o u ld leave a clean hole in th e b oard. If n o t,
the hole can be cleaned b y reheating th e solder and placing
a sharp o b je c t such as a to o th p ic k in to the hole to clean it
o u t. A va cu u m -typ e desoldering to o l can also be used fo r
this purpose.
3.
Bend the leads o f the new c o m p o n e n t to f i t th e holes
in the b o a rd . If th e c o m p o n e n t is replaced w h ile th e board
is m o u n te d in th e in s tru m e n t, c u t the leads so th e y w ill ju s t
p ro tru d e th ro u g h the b oard. Insert the leads in to the holes
in the board so the c o m p o n e n t is fir m ly seated against the
board (o r as p o s itio n e d o rig in a lly ). If it does n o t seat
p ro p e rly , heat th e solder and g e n tly press th e c o m p o n e n t
in to place.
4. T o u c h the iro n to the c o n n e c tio n and a p p ly a small
a m o u n t o f solder to m ake a fir m solder jo in t; d o n o t ap p ly
to o m uch solder. T o p ro te c t heat-sensitive co m p o n e n ts,
ho ld th e lead betw een the c o m p o n e n t b o d y and th e solder
jo in t w ith a pair o f long-nose pliers o r o th e r heat sink.
5. C lip th e excess lead th a t p ro tru d e s th ro u g h th e board
( if n o t c lip p e d in step 3).
6. Clean th e area around the solder c o n n e c tio n w ith a
flu x -re m o v e r solvent. Be careful n o t to rem ove in fo rm a tio n
p rin te d on th e board.
M e ta l
Term inals.
When soldering m etal
te rm in a ls,
o rd in a ry 6 0 /4 0 solder can be used. Use a soldering iro n
w ith a 40- to 7 5 -w a tt ra tin g and a 1 /8 -in ch w id e wedge-
shaped tip .
Observe the fo llo w in g p re ca u tio n s w hen soldering metal
te rm in a ls:
1. A p p ly o n ly enough heat to m ake the solder flo w
fre e ly . Use a heat sink to p ro te c t heat-sensitive c o m
ponents.
2. A p p ly o n ly enough solder to fo rm a solid c o n n e c tio n .
Excess solder m ay im p a ir th e fu n c tio n o f th e p art.
3. I f a w ire extends b e yo n d th e solder jo in t , c lip o ff the
excess.
4.
Clean th e flu x fro m the solder jo in t w ith a flu x -
rem over solvent.
C o m p o n e n t Replacem ent
W A R N I N
G |
D isc o n n e c t the in s tru m e n t fro m the p o w e r source
b e fo re replacing co m ponents.
C irc u it Board Replacement.
I f
a
c ir c u it board is
damaged beyond re p a ir, e ith e r the e n tire assembly in c lu d
ing all soldered-on co m p o n e n ts, o r the board o n ly , can be
replaced. Part num bers are given in th e M echanical Parts
L is t fo r e ith e r th e c o m p le te ly w ire d o r the u n w ire d board.
M o s t o f the co m p o n e n ts m o u n te d on th e c ir c u it boards can
be replaced w ith o u t rem oving th e boards fro m th e in s tru
m ent. Observe the soldering pre ca u tio n s given under S o ld e r
ing T e chniques in th is section.
M ost o f th e c o n n e ctio n s to th e c ir c u it boards in the
in s tru m e n t are made w ith p in co n n e cto rs. H ow e ve r, some
co n n e ctio n s are soldered to the board. Use the fo llo w in g
p rocedure to rem ove a c irc u it b o a rd :
1. D isconnect all pin co n n e cto rs fro m th e board and
unsolder any soldered co n n e ctio n s.
2. Remove all screws h o ld in g th e board to th e chassis.
3. L i f t th e c irc u it board o u t o f the in s tru m e n t. Do n o t
fo rc e o r bend the b oard.
4-9
Содержание 434
Страница 6: ...Fig 1 1 4 3 4 O scilloscope 434 ...
Страница 41: ...Fig 3 3 Channel 2 Input A m p and Preamp detailed block diagram C ir c u it D e s c r ip tio n 4 3 4 ...
Страница 51: ...F ig 3 1 1 S w e e p G e n e ra to r d e ta ile d b lo c k d ia g ra m CO C irc u it D e s c rip tio n 4 3 4 ...
Страница 55: ...C871 Circuit Description 434 ...
Страница 110: ...Rackmounting 434 3 r i C V J o o o o o s w C V J o ip w 0 r 6 4 Fig 6 6 Dim ensional draw ing MkX ...
Страница 153: ......
Страница 157: ...P O A 5 CAM SW 1TC H C H 2 4 3 S20O CH Z INPUT A M P L IF IE R P R E A M P ...
Страница 159: ...4 3 4 5 C O jiiV S O O s 0 s 2 5M S ...
Страница 160: ...434 Fig 8 9 P O A 2 Partial V ertical c irc u it board ...
Страница 161: ...434 ...
Страница 162: ... ...
Страница 170: ... MI5V 3 ...
Страница 172: ......
Страница 173: ...434 Fig 8 20 P O A10 Partial Power Supply Secondary circuit board ...
Страница 174: ...434 Fig 8 21 A l l A 12 Transformer Primary and Secondary circuit boards ...
Страница 175: ......
Страница 177: ...434 5 200 D 3 5 V ...
Страница 179: ... l D z F d s 5V m s 5 7 r JL 4 3 4 S T O R A G E ...
Страница 187: ... FIG 1 Front ...
Страница 197: ...434 R434 FIG 2 Chassis Rear Standard Accessoires ...
Страница 199: ...s g 4 ...
Страница 200: ...434 R434 STORAGE OSCILLOSCOPE FIG 3 Cabinets ...