
10. Soldering Recommendations
10.1 Soldering Recommendations
This section describes the soldering recommendations regarding BGM11S Module.
BGM11S is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal
mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used.
• Refer to technical documentations of particular solder paste for profile configurations.
• Avoid usining more than two reflow cycles.
• A no-clean, type-3 solder paste is recommended.
• A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
• Recommended stencil thickness is 0.100mm (4 mils).
• Refer to the recommended PCB land pattern for an example stencil aperture size
• For further recommendation, please refer to the JEDEC/IPC J-STD-020, IPC-SM-782 and IPC 7351 guidelines.
BGM11S Blue Gecko
Bluetooth
®
SiP Module Data Sheet
Soldering Recommendations
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