
Dimension
MIN
NOM
MAX
D
6.50 BSC
D2
2.925 BSC
D3
4.80 BSC
D4
0.625 BSC
D5
0.75 BSC
e
0.40 BSC
E
6.50 BSC
E2
1.00 BSC
E3
4.80 BSC
E4
3.20 BSC
E5
0.95 BSC
L
0.30
0.40
0.50
L1
0.15
0.20
0.25
L2
0.675
0.725
0.775
L3
0.50
0.60
0.70
eD1
2.00 BSC
eD2
1.00 BSC
eD3
2.40 BSC
eD4
1.525 BSC
eE1
0.80 BSC
eE2
2.025 BSC
eE3
1.00 BSC
eE4
0.85 BSC
aaa
0.10
bbb
0.10
ccc
0.10
ddd
0.10
eee
0.10
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-220.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
5. Hatching lines means package shielding area. 6. Solid pattern (3.1x3.1mm) shows non-shielding area including its side walls. For
side wall, borderline between shielding area and not-shielding area could not be defined clearly like top side.
BGM11S Blue Gecko
Bluetooth
®
SiP Module Data Sheet
Package Specifications
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