Installation and EMC guidelines
1.11 Equipotential bonding
SIMATIC TDC hardware
22
System Manual, 08/2017, A5E01114865-AL
1.11
Equipotential bonding
In order to ensure disturbance-free operation, the networked components may not develop
different potentials. For this reason, all components must be interconnected by means of
equipotential bonding with a minimum cross-section of 16 mm
2
.
Principle of the connection
All components (racks, power supplies, etc.) that are connected by signal cables must also
be interconnected by means of equipotential bonding (exception: components with fiber-optic
connections).
Equipotential busbar
An equipotential busbar should be provided in each control cabinet to facilitate wiring.
All internal and external components must be interconnected with this equipotential busbar.
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