Maintenance and Performance Checks 5-2
Special Handling
of Static Sensitive
Devices
MOS devices are designed to operate at very high impedance
levels for low power consumption. As a result, any normal static
charge that builds up on your person or clothing may be sufficient
to destroy these devices if they are not handled properly. When
handling such devices, use precaution to avoid damaging them as
described below:
1.
MOS IC’s should be transported and handled only in
containers specially designed to prevent static build-up.
Typically, these parts are received in static-protected
containers of plastic or foam. Keep these devices in their
original containers until ready for installation.
2.
Ground yourself with a suitable wrist strap. Remove the
devices from the protective containers only at a properly
grounded work station.
3.
Remove a device by grasping the body; do not touch the
pins
4.
Any printed circuit board into which the device is to be
inserted must also be grounded to the bench or table.
5.
Use only anti-static type solder suckers.
6.
Use only grounded soldering irons.
7.
Once the device is installed on the PC board, the device is
adequately protected and normal handling may resume.
Cleaning
The Model 3152 should be cleaned as often as operating conditions
require. To clean the instrument, use the following procedure:
1.
Thoroughly clean the inside and outside of the instrument.
2.
When cleaning inaccessible areas, remove dust with low
pressure compressed air or a vacuum cleaner.
3.
Use alcohol applied with a cleaning brush to remove
accumulation of dirt or grease from connector contacts and
component terminals.
4.
Clean the exterior of the instrument and the front panel with
a mild detergent mixed with water, applying the solution
with a soft, lint-free cloth.
Repair and
Replacement
Repair and replacement of electrical and mechanical parts must be
accomplished with great care and caution. Printed circuit boards
can become warped, cracked or burnt from excessive heat or
mechanical stress. The following repair techniques are suggested
to avoid inadvertent destruction or degradation of parts and
assemblies:
1.
Use a 60/40 solder and temperature-controlled 35 - 40 watt
pencil-type soldering iron on the circuit board. The tip of the
iron should be clean and properly tinned for best heat
transfer to the solder joint. A higher wattage soldering iron
may separate the circuit from the base material.
Содержание 3152
Страница 16: ...Getting Started 1 7 Figure 1 1 Segment 1 Sin x x Waveform Figure 1 2 Segment 2 Sine Waveform...
Страница 25: ...Configuring The Instrument 2 6 This page was intentionally left blank...
Страница 63: ...Using The Instrument 3 38 This page was intentionally left blank...
Страница 80: ...SCPI Command Reference 4 17 Figure 4 1 SCPI Status Registers...
Страница 121: ...Specifications A 12 This page was intentionally left blank...