NXP Semiconductors SAFE ASSURE FRDMGD3100HBIEVM, Руководство пользователя, Страница: 8 / 35

NXP Semiconductors
UM11134
FRDMGD3100HBIEVM half-bridge evaluation board
UM11134 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
User guide Rev. 3 — 10 February 2020
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Pin Name Function
20 AOUTH Duty cycle encoded signal (high-side)
21 PWMH PWM input (high-side)
22 FSSTATEH Fail-safe state (high-side)
23 GND Ground
24 INTBH Interrupt bar (high-side)
4.4.2 Test point definitions
All test points are clearly marked on the evaluation board. Figure 4 shows the location of
various test points.
Figure 4. Key test point locations
Table 3. Driver board test point definitions
Test point Reference
designator
Definition
Low voltage (LV) domain
VSUP TP2 DC voltage source connection point for VSUP power input of
GD3100 devices and flyback power supplies. Typically supplies by
vehicle b12 V DC, but can also be configured for +5 V DC
operation.
GND TP13, TP14, TP15,
TP16
Grounding points for low-voltage domain
Low-side (LS) driver domain
VCCL TP17 Provides access to measure positive voltage supply powering HV
die and gate driver for low-side IGBT