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NXP Semiconductors
UM11134
FRDMGD3100HBIEVM half-bridge evaluation board
UM11134
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2020. All rights reserved.
User guide
Rev. 3 — 10 February 2020
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TEK MSO 4054 500 MHz 2.5 GS/s 4-channel oscilloscope
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Rogowski coil, PEM Model CWT Mini HF60R or CTW Mini HF30 (smaller diameter)
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Two isolated high voltage probes (CAL Test Electric CT2593-1, LeCroy AP030)
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Four low voltage probes
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Two digital voltmeters
3.3 System requirements
The kit requires the following to function properly with the software:
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Windows 7 or higher operating system
4 Getting to know the hardware
4.1 Overview
The FRDMGD3100HBIEVM is a half-bridge evaluation kit populated with two GD3100
single channel IGBT gate drive devices on a half-bridge evaluation board. The kit
includes the Freedom KL25Z microcontroller hardware for interfacing a PC installed
with SPIGen software for communication to the SPI registers on the GD3100 gate drive
devices in either daisy chain or standalone configuration.
The GD3100 translator board is used to translate 3.3 V signals to 5.0 V signals between
the MCU and GD3100 gate drivers. The evaluation kit can be connected to a single
phase of an Infineon Hybrid PACK Drive IGBT module for half-bridge evaluations and
applications development.
4.2 Board features
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Capability to connect to Infineon Hybrid PACK Drive IGBT module for half-bridge
evaluations
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SPI communication, capable of daisy chain or normal
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Software configurable power and fail-safe controls
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Easy access power, ground and signal test points
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Easy to install and use SPIGen GUI for interfacing via SPI through PC. Software
includes double pulse and short-circuit testing capability
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DC link bus voltage monitor on low-side driver via AMUXIN and AOUT