Specification and Adjustment Manual - ARDAC IBA5
Document Number 44X501R2 – March 15, 2004
3-10
Power-up Sequence
During the power-up sequence, the following occur:
1. Unit downloads program into FPGA, copies ROM information to RAM and checks accuracy.
2. The acceptor checks the note path for covered sensors. If a note was stopped in the note path when
the system was powered-down, it will cover some of the sensors. Depending on the position of the
stopped note and the condition of the stacker, the acceptor will either:
- Drive the note into the stacker cassette.
- Return the note to the customer.
3. The acceptor cycles the stacker punch once. This completes the stacking of any note that was
partially stacked when power was removed from the system.
4. The front sensors are calibrated.
5. The mid-density sensors are calibrated.
6. The TNT sensors are calibrated.
7. The String Sensor is calibrated. This occurs only if the string sensor DIP switch is set to enable the
sensor. For details, refer to Section 1, Description and Specifications, Figure 1-10 and Table 1-2.
8. The presence of the stacker cassette is checked. If present, the stacker is cycled and checked for
proper rest position.
9. The DIP switch settings are checked for note inhibits.
Figure 3-6 Power Up Timing
Storage of Calibration Values
Except for dual density values, all calibration values are stored in volatile RAM on the Microprocessor
Board. Each time power is removed from the System, the old values are discarded. New values are
established through re-calibration when the System is power-up again.
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