Intel Xeon Phi Processor x200, Техническое руководство по тепловым и механическим характеристикам и конструкции

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Intel
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Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002
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5.2.2 Reference Board Layout...........................................................................40
5.2.3 Board Keep-outs.....................................................................................40
5.2.4 Suggested Silkscreen Marking for Socket Identification ................................40
5.2.5 Board Deflection .....................................................................................41
5.3 Fabric Cable Assembly Design Guidance................................................................41
6 Thermal Specifications and Design Guidelines ..........................................................42
6.1 Thermal Specification Overview ...........................................................................42
6.1.1
Thermal Design Power (TDP) and TCASE Specifications ................................42
6.1.2 Case Temperature Geometry and Influence Factors .....................................44
6.1.3 Socket Maximum Temperature .................................................................47
6.1.4 Storage Conditions Specifications..............................................................48
6.1.5 Reference Design Thermal Interface Material (TIM) .....................................48
6.1.6 Reference Thermal Solution Performance Targets........................................49
6.2 Thermal Design and Management Guidelines .........................................................49
6.2.1
System Thermal Environmental Conditions.................................................49
6.2.2 Thermal Solution Performance Characterization ..........................................50
6.2.3 Thermal Test Vehicle (TTV) Correction Factors ............................................51
6.2.4 Thermal Management Guidelines ..............................................................51
A Quality and Reliability Requirements .......................................................................53
A.1 Thermal/Mechanical Solution Stress Test ..............................................................53
A.1.1
Customer Environmental Reliability Testing ................................................54
A.1.2 Socket Durability Test .............................................................................54
A.1.3 Intel Reference Component Validation .......................................................54
A.2 Ecological Requirement.......................................................................................55
B Supplier Listing ........................................................................................................57
B.1 Intel Enabled Supplier Information .......................................................................57
C Processor Package Mechanical Drawings .................................................................61
D LGA3647-1 Socket-P1 Mechanical Drawings .............................................................66
E Retention Assembly Mechanical Drawings ................................................................71
F Mechanical KOZs ....................................................................................................111
F.1 Main Board Mechanical KOZs ............................................................................. 111
Figures
1-1 Processor Mechanical Assembly................................................................................ 8
2-1 Processor Package Assembly Sketch ........................................................................13
2-2 Processor with Fabric Package Assembly Sketch ........................................................13
2-3 Processor with the Integrated Heat Spreader ............................................................14
2-4 Processor with Fabric Package Features and Design Attributes.....................................15
2-5 Processor Top and Bottom View ..............................................................................16
2-6 Processor with Fabric Top and Bottom View ..............................................................17
3-1 LGA3647-1 Socket Assembly with PnP Covers ...........................................................20
3-2 Hexagonal Array in LGA3647 Socket BGA Ball Footprint..............................................21
3-3 Socket-P1 and Bolster Plate Assembly Alignment Features ..........................................24
3-4 Socket-P1, Mechanical Retention Assembly and PHM Alignment ...................................24
3-5 LGA3647-1 Socket Contact Orientation ....................................................................26
3-6 Offset between LGA Land Center and Solder Ball Center .............................................27
3-7 Offset between LGA Land Center and Solder Ball Center .............................................28
3-8 Contact Force Versus Contact Deflection Range .........................................................29
3-9 Wetting Angle and Wetting Height ...........................................................................30
4-1 Backplate and Insulator with Mounting Screws ..........................................................32