Intel Xeon Phi Processor x200, Техническое руководство по тепловым и механическим характеристикам и конструкции

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Order Number: 334785-002 Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
49

Thermal Specifications and Design Guidelines
6.1.6 Reference Thermal Solution Performance Targets
Table 6-6 provides thermal boundary conditions and performance targets for the
processor. These values serve as guidance for designing a processor compatible
thermal solution. Heatsink design compliance can be determined with thermocouples
and TTVs.
Table 6-6. Reference Heatsink Boundary Conditions and Performance Targets
Parameter Processor Processor with Fabric Notes
TDP 215W 230W
T
LA (max)
40
°
C 1
System height (form
factor)
1U 2
Heatsink volumetric Overall: 80 x 107 x 27 mm (W x L x H) 3
Heatsink Technology Cu base with Al fins
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Reference system configuration. 1U = 1.75 inches.
3. Dimensions of reference heatsink do not include socket, processor, or other retention assembly
components.
6.2 Thermal Design and Management Guidelines
6.2.1 System Thermal Environmental Conditions
6.2.1.1 Ambient Temperature
The temperature of the inlet air entering the processor heatsink module is referenced in
this document as the local ambient temperature (T
LA
). This is not a system
requirement, rather simply the local ambient temperature upstream from the
processor. It is measured from the air upstream and in close vicinity to the processor
heatsink module. For other cooling systems, the ambient temperature is measured
from the inlet air to the cooling device.
6.2.1.2 Airflow
Airflow should be provided by a system fan or blower in order to cool the processor
package. See the recommended airflow rate for the reference heatsink in
Table 6-7 .
Table 6-7. Thermal Solution Performance Design Targets and Environment
Parameter Maximum Unit Notes
T
LA
40 °C This is the temperature at the processor cooling devices
Pressure Drop 137 (0.55) Pa (inch H
2
O) Total pressure drop across the processor cooling devices
Altitude Sea-level Thermal solution optimized for performance at sea-level.
De-rate at higher altitudes.
Airflow 9.44 (20) l/s (CFM) Airflow through the heatsink fins
Note: Thermal boundary conditions are applied in establishing the processor heatsink cooling solution.