Intel Xeon Phi Processor x200, Техническое руководство по тепловым и механическим характеристикам и конструкции

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Intel
®
Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002
6
F-3 Processor Heatsink Module Backplate Keep-Out Zone............................................... 114
Tables
1-1 Related Documents ................................................................................................ 9
1-2 Terms and Terminology .........................................................................................10
2-1 Processor Materials................................................................................................16
3-1 LGA3647-1 Socket Attributes..................................................................................20
3-2 Socket Loading and Deflection Specifications ............................................................22
3-3 PnP Cover Ergonomics Requirements .......................................................................30
4-1 Bolster Plate Mechanical Load Specifications .............................................................37
4-2 Back Plate Design Criteria ......................................................................................37
4-3 Bolster Plate Design Criteria ...................................................................................37
4-4 Heatsink Mechanical Attributes................................................................................38
5-1 LGA3647-1 Socket and Retention Component Mass ...................................................39
6-1 TDP and T
CASE
Specifications - 215W/230W SKUs ......................................................42
6-2 TDP and T
CASE
Specifications - 245W/260W SKUs ......................................................43
6-3 Processor T
CASE
Influence Parameters ......................................................................45
6-4 Storage Condition Ratings ......................................................................................48
6-5 TIM Specification...................................................................................................48
6-6 Reference Heatsink Boundary Conditions and Performance Targets ..............................49
6-7 Thermal Solution Performance Design Targets and Environment ..................................49
A-1 Example Thermal Stress Test: Use Condition Environment Definitions ..........................53
A-2 Example Mechanical Stress Test: Use Condition Environment Definitions.......................54
B-1 Intel Xeon Phi Processor Platform Thermal/Mechanical Assembly Part Information..........58
C-1 Processor Package Drawing List ..............................................................................61
D-1 Socket Drawing List...............................................................................................66
E-1 Mechanical Drawing List .........................................................................................71
F-1 Mechanical Keep-Out Zone Drawing List ................................................................. 111