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

Thermal Specifications and Design Guidelines

Intel

®

Xeon

®

Phi™ Processor x200 Product Family TMSDG

Order Number: 334785-002

42

6

Thermal Specifications and

Design Guidelines

6.1

Thermal Specification Overview

The processor is a Multi-Chip Package (MCP), meaning it has integrated multiple silicon
devices onto the processor substrate. These devices include the processor (CPU) die,
eight Multi-Chip DRAMs (MCDRAMs) and, in some configurations, a networking (or
fabric) controller die. See

. Although there are multiple

components on the processor package, there will be a single Integrated Heat Spreader
(IHS) on the MCP which serves as an interface to the system thermal solution.

The MCP requires the thermal solution to maintain die temperatures within the
specified operating limits for all devices in the MCP. Any attempt to operate the
processor or other die outside these limits may result in permanent damage to the
processor and potentially other components within the system. Maintaining the proper
thermal environment is key to optimal and reliable, long-term processor and system
operation.

A complete thermal solution includes both component- and system-level thermal
management features. Component-level thermal solutions can include active or passive
heatsinks attached to the processors’ IHS. Typical system-level thermal solutions may
consist of system fans combined with ducting and venting.

6.1.1

Thermal Design Power (TDP) and T

CASE

Specifications

and

list the Thermal Design Power (TDP) and T

CASE

values for the

different processor SKUs, under both CPU- and memory-centric workloads.

Table 6-1.

TDP and T

CASE

Specifications - 215W/230W SKUs

Processor

Processor with Fabric

Workload

CPU Centric

Memory Centric

CPU Centric

Memory Centric

CPU Power

185W

147W

185W

147W

Memory Power

30W

68W

30W

68W

IOP Fabric Die Power

N/A

15W

Total Power

215W

230W

CPU Die Maximum T

CASE

82

°

C

N/A

1

84

°

C

N/A

1

MCDRAM Die Maximum T

CASE

N/A

2

72 °C

N/A

2

75 °C

Fabric Die Maximum T

CASE

N/A

N/A

3

Minimum T

CASE

4

5

°

C

.

Notes:

1.

Memory-centric workloads: CPU T

CASE

is expected to be lower than the maximum CPU T

CASE

target.

2.

CPU-centric workloads: Memory T

CASE

is expected to be lower than the maximum memory T

CASE

target.

3.

Fabric die T

CASE

targets: The fabric die is expected to remain below it’s maximum allowable temperature for

all workloads, as long as the thermal solution provides adequate cooling to the CPU and MCDRAM die.

4.

ASHRAE thermal envelopes allow scenarios where the data center ambient temperature may drop below



5

°

C, down to 0

°

C. However, the processor silicon temperatures are expected to quickly rise above 5

°

C

once operational. Contact your Intel representative if you believe your data center implementation

warrants further consideration of minimum operational temperatures down to 0

°

C.

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Содержание Xeon Phi Processor x200

Страница 1: ...Order Number 334785 002 Intel Xeon Phi Processor x200 Product Family Thermal Mechanical Specification and Design Guide TMSDG June 2017 Revision 002...

Страница 2: ...s any warranty arising from course of performance course of dealing or usage in trade Intel Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability Intel Tur...

Страница 3: ...faces 22 3 3 Socket Components 23 3 3 1 Socket Housing 23 3 3 2 Markings 25 3 3 3 Socket Package Contact Characteristics 26 3 3 4 Solder Ball Characteristics 29 3 4 Socket Size 30 3 5 Actuation and In...

Страница 4: ...A 1 2 Socket Durability Test 54 A 1 3 Intel Reference Component Validation 54 A 2 Ecological Requirement 55 B Supplier Listing 57 B 1 Intel Enabled Supplier Information 57 C Processor Package Mechanic...

Страница 5: ...on Fabric 2 2 80 E 9 Heatsink Module Clip Fabric 1 2 81 E 10 Heatsink Module Clip Fabric 2 2 82 E 11 Backplate 83 E 12 Backplate Insulator 84 E 13 Back Plate M3 Stud 85 E 14 Bolster Plate 1 2 86 E 15...

Страница 6: ...ntion Component Mass 39 6 1 TDP and TCASE Specifications 215W 230W SKUs 42 6 2 TDP and TCASE Specifications 245W 260W SKUs 43 6 3 Processor TCASE Influence Parameters 45 6 4 Storage Condition Ratings...

Страница 7: ...ted contact area plating information Section 4 1 2 Updated note regarding Nut Durability Spec Appendix B Updated Intel and vendor P Ns Appendix E Updated assembly mechanical drawings Appendix F Update...

Страница 8: ...ith fabric will represent the Intel Xeon Phi processor with integrated Intel Omni Path Fabric Intel OP Fabric 1 2 Scope Figure 1 1 provides a conceptual illustration of the processor mechanical assemb...

Страница 9: ...echanical designers Designers and suppliers of processor thermal solutions The guidelines recommended in this document are based on experience and simulation and preliminary work done at Intel while d...

Страница 10: ...Array processor package and socket interface MCDRAM Multi Channel Dynamic Random Access Memory PECI Platform Environment Control Interface standard for thermal management using DTS is a one wire inter...

Страница 11: ...ally conductive compound between the heatsink and the processor IHS This material fills the air gaps and voids and enhances the transfer of the heat from the processor IHS to the heatsink TLA The loca...

Страница 12: ...he processor silicon die and eight MCDRAM chips all housed in a Flip Chip FC Land Grid Array LGA package that interfaces with the main board via an LGA3647 1 socket The package incorporates an Integra...

Страница 13: ...re 2 1 Processor Package Assembly Sketch Figure 2 2 Processor with Fabric Package Assembly Sketch Order Number 334785 002 Intel Xeon Phi Processor x200 Product Family TMSDG 13 Processor Mechanical Des...

Страница 14: ...ble connection Figure 2 3 shows a photograph of the IHS on a processor Figure 2 3 Processor with the Integrated Heat Spreader Notes 1 The hole in the IHS above allows for outgassing during TIM materia...

Страница 15: ...ge Alignment Length Package Alignment Width Package Substrate Thickness Land Length Land Width Land True Position Pattern Relating Land Co planarity Substrate Flatness 2 3 2 Other Processor Package Sp...

Страница 16: ...5 Processor Material The table below lists some of the package components and associated materials Table 2 1 Processor Materials Component Material Integrated Heat Spreader Nickel Plated Copper Subst...

Страница 17: ...1 socket 30 times IFP Cable Attachment Cycling processor with fabric only Mating and unmating of the processor package and the Linear Edge Connector LEC54A on the Intel Fabric Passive IFP cable limit...

Страница 18: ...essor is properly oriented that is the processor pin 1 is in the same direction as the socket pin 1 and that there are no contaminations or foreign material on the land pads or gold fingers In cases w...

Страница 19: ...ed by the supplier with PnP covers attached to each appropriate half of the socket body The main body of the socket which is made of electrically insulated material with resistance to high temperature...

Страница 20: ...nd above the surface of the socket to make contact with the pads located at the bottom of the processor package Solder balls enable the socket to be surface mounted to the main board Each contact has...

Страница 21: ...rd assembly process and sequence may be different from one design to another and may require multiple assembly steps The socket will be attached to the main board solely via its 3647 solder balls Ther...

Страница 22: ...which might occur during board manufacturing assembly or testing See the LGA3647 1 Board Flexure Initiative BFI Strain Guidance Sheet Contact your Manufacturer Certified Quality Engineer CQE represent...

Страница 23: ...d place vision systems Components of the socket may be different colors as long as they meet the above requirement 3 3 1 2 Socket Insertable Alignment Keys The alignment keys for the package to socket...

Страница 24: ...rder Number 334785 002 24 The socket also has two orientation posts or protrusions keys placed on opposite sides of the socket as noted in Appendix D The package substrate will have keying notches at...

Страница 25: ...nted soldered to the board Refer to Appendix D for details 3 3 1 6 Strength of Socket Housing Material The material of the socket housing is required to have a minimum yield strength of 35 MPa at 90 C...

Страница 26: ...ure indicate the wiping orientation of the contacts in the two regions to be 60 about the horizontal axis There are 1823 and 1824 contacts in the right and left halves of the socket respectively Figur...

Страница 27: ...to ensure compliance with all electrical requirements of the socket The cumulative normal force load of all contacts must not exceed the load limits defined in Table 3 2 3 3 3 1 Contact Pad Mating Lo...

Страница 28: ...lustrated by the blue curve in Figure 3 8 to ensure adequate contact normal force in order to meet BOL upper boundary and EOL lower boundary performance targets at all contact locations Minimum contac...

Страница 29: ...y The co planarity profile requirement for all solder balls on the underside of the socket is defined in Appendix D The specification is applicable to all temperature ranges when surface mounting the...

Страница 30: ...ne of the socket Movement will be along the axis normal to the seating plane 3 5 2 Insertion Removal Actuation Forces Any actuation will meet or exceed SEMI S8 95 Safety Guidelines for Ergonomics Huma...

Страница 31: ...The cover can withstand 260 C for 40 seconds typical reflow rework profile without degrading The cover design should allow use of a tool to remove the cover The force required for removing of the cov...

Страница 32: ...structural rigidity to the entire heatsink and processor package retention on the topside of the main board and helps ensure long term solder joint reliability It is 2 2 mm thick and made of carbon s...

Страница 33: ...ing socket to processor contact force ensures maximum contact areas between socket pins and processor package lands as well as between package and heatsink The springs provide 180 250 lbf The springs...

Страница 34: ...embly Pin A1 Mark 4 1 3 Processor Package Carrier The carrier is an integral part of the Processor Heatsink Module PHM The processor package is inserted into the carrier then the Thermal Interface Mat...

Страница 35: ...Package Clip Heatsink Alignment And Attach Clips Figure 4 4 Processor with Fabric Package Carrier Pin A1 Alignment Mark Package Alignment Feature Package Fabric End Alignment Clip Heatsink Alignment...

Страница 36: ...rocessor Mechanical Assembly Heatsink Assembly Package Carrier TIM PCM45F Processor Bolster Plate Assembly Socket P1 Main Board Back Plate Assembly Processor Heatsink Loading Module PHLM 4 2 Mechanica...

Страница 37: ...odule tolerances package stack tolerances load degradation etc must be considered Table 4 2 Back Plate Design Criteria Parameter Value Note Material thickness 2 2 mm To meet the PCB secondary side cle...

Страница 38: ...Stiffness 1 600 lbf mm 1250 lbf mm 1400 lbf mm Short span point load Long span Short span distributed load Flatness 0 077 mm manifesting Processor local flatness zone in drawing Base Thickness 4 5 mm...

Страница 39: ...al and mechanical solution in accordance with their design and environmental validation criteria and should not rely solely on these design guidelines 5 1 1 Components Volumetric The baseboard Keep Ou...

Страница 40: ...E 1 Boards outside this range may require modifications to the back plate and heatsink retention 5 2 2 Reference Board Layout The processor reference board is a single node PCB 173 x 360 mm 6 8 x 14...

Страница 41: ...ric Cable Assembly Design Guidance This section applies only to designs supporting the processor with fabric CPU Package Mechanical Design Refer to Section 2 and Appendix C for the processor with fabr...

Страница 42: ...rs IHS Typical system level thermal solutions may consist of system fans combined with ducting and venting 6 1 1 Thermal Design Power TDP and TCASE Specifications Table 6 1 and Table 6 2 list the Ther...

Страница 43: ...the code and data within the processor s on die cache These applications would be expected to maximize the power consumption of the CPU silicon and reduce the MCDRAM power As an example applications...

Страница 44: ...processor MCPs one for the processor die and two options for the MCDRAM die See Figure 6 1 and Figure 6 2 for the TCASE locations Which MCDRAM TCASE location to measure depends upon the direction of...

Страница 45: ...Calculated TLA Temperature of the local ambient air at the heatsink inlet 40 C PCPU Power dissipated by the processor Workload Dependent1 PMCDRAM Power dissipated by MCDRAMs Workload Dependent1 PFABR...

Страница 46: ...ce thermal solution Example 1 Processor TCASE based on a hypothetical processor centric type workload TCASE_CPU TLA CC PCPU CM PMCDRAM CF PFabric 40 0 212 185 0 134 30 0 140 15 85 C Example 2 MCDRAM T...

Страница 47: ...ult in socket body deformation or increases in thermal and electrical resistance which can cause a thermal runaway and eventual electrical failure The guidance for socket maximum temperature is listed...

Страница 48: ...ened bag includes 6 months storage time by customer 0 30 months Timeshort term storage A short period of time in shipping media 0 72 hours Tabsolute storage The minimum maximum device storage temperat...

Страница 49: ...vironmental Conditions 6 2 1 1 Ambient Temperature The temperature of the inlet air entering the processor heatsink module is referenced in this document as the local ambient temperature TLA This is n...

Страница 50: ...components downstream from the processor are met while ensuring the processor thermal targets are met Figure 6 4 Reference Heatsink Pressure Drop Curve 6 2 2 Thermal Solution Performance Characteriza...

Страница 51: ...processor cooling solution is capable of meeting the processor based TCASE specifications In some situations implementation of DTS based thermal solutions can reduce average fan power and improve acou...

Страница 52: ...t temperature conditions However the acoustics cannot be optimized based on the behavior of the processor temperature If FSC is based only on the DTS sustained temperatures above TCONTROL drive fans t...

Страница 53: ...Failure Mechanism Slow small internal gradient changes due to external ambient temperature cycle or externally heated Fast large gradient on off to max operating temperature power cycle or internally...

Страница 54: ...or x200 Product Family TMSDG Order Number 334785 002 54 Note Need to pass customer visual thermal mechanical and electrical requirements A 1 1 Customer Environmental Reliability Testing The conditions...

Страница 55: ...ad and Bromine containing flame retardants Legislation varies by geography European Union RoHS WEEE China California and so forth The following definitions apply to the use of the terms lead free Pb f...

Страница 56: ...bromine 1500 ppm maximum total halogens It is required that the production version of the socket the Processor Heatsink Module PHM including the Thermal Interface Material TIM and the processor mecha...

Страница 57: ...a convenience to its customers Intel does not make any representations or warranties whatsoever regarding the quality reliability functionality or compatibility of these devices All Part Numbers P N l...

Страница 58: ...ager Connie smiriglio honeywell com 1 845 627 2750 Hyo Xi Technical Hyo xi honeywell com 430 Li Bing Rd Zhangjiang Hi Tech Park Pudong SH Shanghai 31 201203 China 86 21 28943106 H38442 001 099079 Proc...

Страница 59: ...P N Lotes P N Foxconn P N H77975 005 AZIF0084 P002C WNMEL00 81N00 EH Bolster Plate with Dust Cover Assembly Bolster plate posts leaf spring assembly and insulator Skt P plastic handling cover Intel P...

Страница 60: ...1H 15 inch Gold Contacts Right Side P N Left Side P N Intel H37600 202 Foxconn PE36473 11NK1 1H Intel H37600 203 Foxconn PE36473 11NK2 1H Tyco Tyco Electronics TE Connectivity Ellen Liang ellen yh li...

Страница 61: ...Drawings Table C 1 lists the processor Package Mechanical Drawings PMD included in this appendix Table C 1 Processor Package Drawing List Drawing Description Figure Number Processor PMD Sheet 1 of 2 F...

Страница 62: ...1 17 12 722 1 2 7 20321 17 2 7 21 6 127 6 2 1 1 7 6 5 1 6 0 2 0 0 7 56 200 176 120 72 12 6 5 9 7 5 1 352 7 21 0 7 5 1 6 33529 5 1 6 1 7 7 7 7 2 127 6 5 1 6 6 7 2 0 66 21 2 9 3 2 2 6 17 5 5 1 180 5 6 7...

Страница 63: ...0 7 6 6 0 2 0 0 7 56 200 176 120 72 5 1 5 7 7 7 9 9 9 6 0 2 0 0 7 56 200 176 120 72 1 6 0 2 0 0 7 56 200 176 120 72 0 62 5 5 6 67 23 1 1 0 0 0 0 0 0 0 0 5 0 5 0 5 0 12 6 5 9 2 127 6 5 1 6 6 7 2 5 1 18...

Страница 64: ...5 1 352 66 72 5 1 6 35 0 1 5 1 68 7 72 1 8321 9 7 2 857 5 7 1 1 0 5 21 12 20321 176 2 20321 17 12 722 1 2 685 1 1 21 6 0 2 0 0 7 56 200 176 120 72 1 1 1 1 1 1 12 6 5 9 7 5 1 352 7 21 0 7 5 1 6 33529 5...

Страница 65: ...56 200 176 120 72 5 1 5 1 5 1 5 1 7 1 7 1 7 1 7 1 9 1 9 1 9 1 1 1 1 1 6 0 2 0 0 7 56 200 176 120 72 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 6 0 2 0 0 7 56 200 176 120 72 0 62 5 5 6 67 23 1 1 0 0 0 0 0 0 0...

Страница 66: ...chanical Drawings Table D 1 lists the socket drawings included in this appendix Table D 1 Socket Drawing List Drawing Description Figure Number Socket Mechanical Drawing Sheet 1 of 4 Figure D 1 Socket...

Страница 67: ...5 785 7 5023 67 8 9 1 6 121 3 1 0 5 5 9 6 21 6725 21 5 9 6 5 37 21 7 33529 86720 5 5 5 1 12 6 5 9 7 5 1 352 7 21 0 7 5 1 6 33529 5 1 6 1 7 7 7 7 2 127 6 5 1 6 6 7 2 5 1 180 5 6 7 7 5 9 3 570 17 6 127...

Страница 68: ...9 0 3 7 9 0 3 7 9 1 5 8 1 5 8 1 5 8 1 5 8 1 5 8 52 6 2 8016 7 6 62 5 6 62 5 0 7 5 7 6 5 7 6 27720 9 723 9 6 9 25 607 62 7 12 6 5 9 2 127 6 5 1 6 6 7 2 5 1 180 5 6 5 9 3 570 17 0 66 21 2 9 3 2 2 6 17...

Страница 69: ...8016 7 6 62 5 6 62 5 0 7 5 7 6 7 6 0 8 5 1 8 5 1 8 5 1 8 5 1 8 5 1 9 7 3 0 9 7 3 9 7 3 0 9 7 3 0 9 7 3 0 62 7 12 6 5 9 2 127 6 5 1 6 6 7 2 5 1 180 5 6 5 9 3 570 17 0 66 21 2 9 3 2 2 6 17 5 Order Numbe...

Страница 70: ...9 3267 607 217 7 7 36 0 0 0 0 7 5 607 217 7 7 36 6 9 3267 607 62 7 12 6 5 9 2 127 6 5 1 6 6 7 2 5 1 180 5 6 5 9 3 570 17 0 66 21 2 9 3 2 2 6 17 5 LGA3647 1 Socket P1 Mechanical Drawings Intel Xeon Ph...

Страница 71: ...ackplate Figure E 11 Backplate Insulator Figure E 12 Back Plate M3 Stud Figure E 13 Bolster Plate 1 2 Figure E 14 Bolster Plate 2 2 Figure E 15 Bolster Plate Insulator Figure E 16 Bolster Plate Small...

Страница 72: ...5 002 72 1U Heatsink PCM45F TIM Reference Only Figure E 34 1U Heatsink Nut M4 1 2 Reference Only Figure E 35 1U Heatsink Nut M4 2 2 Reference Only Figure E 36 1U Heatsink Nut Collar Reference Only Fig...

Страница 73: ...TO H77469 002 2 11 16 PG1 A3 PG2 A3 PG3 D6 PG3 B3 PG1 A3 PG1 C7 09 1 REMOVED DATUM B AND UPDATED NOTE 2 TO REFLECT THE CHANGE 2 REMOVED CTF DIMENSION 3 ADDED CTF DIMENSION 4 REMOVED THE WORD PRODUCTIO...

Страница 74: ...A A A 2x 26 2x 32 2x 44 2X 70 44 81 6 108 6 35 35 13 7X 6 8 0 2 7X 3 59 H77469 2 09 DWG NO SHT REV SHEET 2 OF 3 DO NOT SCALE DRAWING SCALE 2 1 09 H77469 D REV DRAWING NUMBER SIZE DEPARTMENT SEE DETAI...

Страница 75: ...V SHEET 3 OF 3 DO NOT SCALE DRAWING SCALE 2 1 09 H77469 D REV DRAWING NUMBER SIZE DEPARTMENT BOTTOM SIDE NON INSULATOR SIDE NO METAL CAN BE EXPOSED OVERHANG OF INSULATOR ON INNER AND OUTER EDGES OF TH...

Страница 76: ...RT MARKING CHANGED IN VIEW 5 6 15 04 1 PART AND REV CHANGED ON BOLSTER PLATE ASSEMBLY 6 11 15 05 1 ROLLED ASSY PART NUMBER FROM H78747 004 TO H78747 005 BASED ON BOLSTER PLATE LEC GUIDE PIN CHANGES 8...

Страница 77: ...E CONTROLLED BY 3D CAD DATABASE FOR FEATURES NOT EXPLICITLY TOLERANCED BASIC DIMENSIONS FROM THE 3D CAD DATABASE 3 MARK ASSEMBLY PART APPROXIMATELY WHERE SHOWN PER INTEL MARKING STANDARD 164997 WITH A...

Страница 78: ...ATE IS ACCEPTABLE 3 4X BOLSTER INSTALLATION HOLES LOCATION MUST ALLOW T 20 DRIVER TO TIGHTEN H19328 NUTS IN ASSEMBLED STATE ADJUST HOLE LOCATIONS IN H37309 AS NEEDED 4X 6 2X 8 3X 7 5 12 2X 13 14 7X 15...

Страница 79: ...SYMBOLS FROM GUIDE POSTS 7 INCREASED SIZE OF PIN 1 TRIANGLE HOLE 8 ROLLING PART NUMBER FROM H53249 002 TO H53249 003 6 3 16 PG1 A2 PG2 B7 10 1 REMOVED FIVE CTF DIMENSIONS ON PAGE 1 AND TWO ON PAGE 2...

Страница 80: ...O BOX 58119 SANTA CLARA CA 95052 8119 R 82 5 62 5 R0 5 R0 5 7 97 0 1 9 97 0 1 A H53249 2 10 DWG NO SHT REV SHEET 2 OF 2 DO NOT SCALE DRAWING SCALE 2 1 10 H53249 D REV DRAWING NUMBER SIZE DEPARTMENT 4...

Страница 81: ...E 8 ROLLING PART NUMBER FROM H53248 002 TO H53248 003 6 3 16 PG1 A2 PG2 B7 09 1 REMOVED TWO CTF DIMENSIONS ON PAGES 1 AND 2 2 REMOVED COSMETIC TEXT PRE PRODUCTION 7 18 16 NOTES UNLESS OTHERWISE SPECIF...

Страница 82: ...BOX 58119 SANTA CLARA CA 95052 8119 R 62 5 82 5 R0 5 9 97 0 1 7 97 0 1 R0 5 A H53248 2 09 DWG NO SHT REV SHEET 2 OF 2 DO NOT SCALE DRAWING SCALE 2 1 09 H53248 D REV DRAWING NUMBER SIZE DEPARTMENT 11 4...

Страница 83: ...CE DOCUMENTS ASME Y14 5M 2009 STANDARD DIMENSION AND TOLERANCES UL1439 UL SHARP EDGE TESTING 164997 INTEL MARKING STANDARD A29419 INTEL TOLERANCE STANDARD FOR SHEETMETAL C25432 INTEL COSMETIC SPEC FOR...

Страница 84: ...2 UPDATED PROFILE TOLERANCE 5 7 15 PG1 B2 PG1 C4 05 1 REMOVED CTF CALLOUT SYMBOL TO OUTER BASIC DIMENSIONS 2 INCREASED DIAMETER TOLERANCE FROM 12 TO 25 5 21 15 06 1 REMOVED DIMENSIONS 2 INCREASED PRO...

Страница 85: ...GED THE HEIGHT FROM 6 334 TO 6 72 2 PART NUMBER ROLLED FROM H12853 003 TO H12583 004 2 11 16 A7 07 1 REMOVED CTF DIMENSIONS 7 11 16 NOTES 1 REFERENCE DOCUMENTS ASME Y14 5 2009 STANDARD DIMENSION AND T...

Страница 86: ...POSITON FLANGE WIDTH TOLERANCE FROM 0 1 TO 0 2 4 CHANGED NOTE 2 PROFILE TOLERANCE FROM 0 2 TO 0 4 5 ADDED NOTE 10 6 CHANGED 18 BASIC DIMENSION TO A DIMENSION WITH TOLERANCE 10 20 15 PG2 D6 13 1 ADDED...

Страница 87: ...75 0 15 2X 0 18 0 1 0 4 A B 2X 2 6 2X 7 2 2X 3 65 22 45 47 8 2X 44 25 2X 40 57 0 15 A A 3 5 G93727 2 15 DWG NO SHT REV SHEET 2 OF 2 DO NOT SCALE DRAWING SCALE 3 1 15 G93727 D REV DRAWING NUMBER SIZE...

Страница 88: ...C6 07 1 CHANGED THE FOUR CENTER HOLE DIAMETERS FROM 5 0MM TO 3 8MM 2 ROLLED THE PART NUMBER FROM G93729 002 TO G93729 003 10 7 15 08 1 CHANGED THE CENTER HOLE DIAMTERS BACK TO 5 0MM SO SUPPLIERS WOUL...

Страница 89: ...OL 2 ADDED NOTE 7 TO CALLOUT REQUIRED PUSH OUT FORCE 3 ADDED GD T FEATURE CONTROL FRAMES 8 28 15 B 6 07 1 ADDED OPTIONAL CHAMFER RADIUS TO AID IN ASSEMBLY OF PART 10 01 15 C 7 C 7 08 1 CHANGED FEATURE...

Страница 90: ...AND CALLOUT 7 SYMBOL 2 ADDED NOTE 7 TO CALLOUT REQUIRED PUSH OUT FORCE 3 ADDED GD T FEATURE CONTROL FRAMES 8 28 15 B 6 07 1 ADDED OPTIONAL CHAMFER RADIUS TO AID IN ASSEMBLY OF PART 10 01 15 C 7 08 1 C...

Страница 91: ...T NUMBER TO 003 4 16 15 04 UPDATED NOTE 4 SYMBOL CALL OUT FOR CRITICAL TO FUNCTION DIMENSIONS 4 23 15 6 A 05 1 REMOVED THE PIN HEAD 2 ROLLED THE DASH PART NUMBER FROM H78231 003 TO H78231 004 8 28 15...

Страница 92: ...6MM 4 MODIFIED NOTE 4 TO INCLUDE LUBRICANT OR MATERIAL CHANGE TO SUS416 5 ROLLED PART NUMBER FROM H77926 004 TO H77926 005 10 28 15 D 8 07 1 UPDATED NOTE 4 TO REQUIRE THE MATERIAL TO BE SUS 416 AND L...

Страница 93: ...HANGED FROM 4 67 TO 5 45 6 9 15 09 1 ROLLED THE DASH ASSY PART NUMBER FROM H37308 006 TO H37308 007 THE M4 STUD CHANGED PART NUMBER FROM H78186 003 TO H95019 002 TO SHARE SAME STUD WITH SKX 8 28 15 B2...

Страница 94: ...HOLE DIMENSION CHANGED FROM 4 4MM TO 4 05MM AND ACCESS HOLE LOCATIONS 4 23 15 8 C 5 C 2 B 08 1 ADDED DIMENSION AND TOLERANCE 2 UPDATED NOTE CALLOUT FOR STUD DWG FROM H77925 TO H78186 3 CHANGED NOTE 3...

Страница 95: ...MATERIAL 2 ADDED MINIMUM THREAD LEAD IN 0 25 3 REMOVED CTF SYMBOL FROM THE 8 0MM AND 7 65MM DIMENSION 4 ROLLING PART NUMBER J14344 001 TO J14344 002 6 3 16 G7 03 1 REMOVED TWO CTF DIMENSIONS 7 11 16...

Страница 96: ...3 27 15 03 MODIFIED SQUARE ON NOTE 4 TO A TRIANGLE 4 23 15 04 UPDATED NOTE 2 AND ADDED DATUM 9 15 15 NOTES 1 REFERENCE DOCUMENTS ASME Y14 5M 2009 STANDARD DIMENSION AND TOLERANCES UL1439 UL SHARP EDGE...

Страница 97: ...C6 B7 09 1 REMOVED FLATNESS CALLOUT 2 REMOVED FEATURE CONTROL FRAME 3 DELETED DUPLICATE DIMENSIONING 10 15 15 B8 C6 10 1 INCREASED TOLERANCE RANGE FROM 0 04 TO 0 08 2 INCREASED TOELRANCE RANGE FROM 0...

Страница 98: ...MBER FROM 002 TO 003 5 6 15 06 1 UPDATED DIMENSIONING SCHEME 9 11 15 B6 D7 07 1 ADDED CTF DIMENSION TO COLLAR DIAMETER 2 ADDED DATUMS A AND B TO THE FEATURE CONTROL FRAME IN NOTE 2 7 11 16 NOTES UNLES...

Страница 99: ...PROTRUSION BY 0 5MM DIMENSION FROM RIB TO INSIDE LATCH CHANGED FROM 7 9MM TO 7 4MM CHANGED AND TESTED FOR KNL CORNER STANDOFFS 2 DASH PART NUMBER ROLLED FROM H77975 003 TO H77975 004 5 11 16 PG1 A4 0...

Страница 100: ...8 2X 83 2X 63 55 4 2X 14 72 4X 4 0 05 2X 47 5 4X 9 0 1 0 8 0 05 0 85 0 05 120 4 01 0 05 7 4 0 05 H77975 2 08 DWG NO SHT REV SHEET 2 OF 2 DO NOT SCALE DRAWING SCALE 3 08 H77975 D REV DRAWING NUMBER SI...

Страница 101: ...T NUMBER FROM 004 TO 005 5 NUT CHANGED FROM 004 TO 006 3 31 15 H 1 REPLACED H19326 005 M4 NUT TO A NEW T 30 TORX NUT H94876 002 2 CHANGED HEATSINK DELRIN WASHER INNER DIAMETER TO H37265 004 3 REPLACED...

Страница 102: ...ANTA CLARA CA 95052 8119 R A A A A A 70 47 H37264 2 L DWG NO SHT REV SHEET 2 OF 2 DO NOT SCALE DRAWING SCALE 2 L H37264 D REV DRAWING NUMBER SIZE DEPARTMENT 5 4X 4 TIM APPLICATION AREA TIM TO BE CENTE...

Страница 103: ...4 OBLONGS HOLES 2 REMOVED BOTTOMSIDE ALIGNMENT HOLE 3 SHORTENED OUTER FINS 3 ADDED TOP AND BOTTOM CHAMFER ON TWO CENTER HOLES 4 INCREASED COUTERBORE DIAMETER FROM 7 4MM TO 8 5MM 5 ROLLED THE PART NUM...

Страница 104: ...2X 2 5 2X 3 0 G97766 2 N DWG NO SHT REV SHEET 2 OF 2 DO NOT SCALE DRAWING SCALE 2 1 N G97766 D REV DRAWING NUMBER SIZE DEPARTMENT CHAMFER ALL FINS THE NOTCH WOULD BE 0 2MM MAX DEEPER THAN OUTBOARD GR...

Страница 105: ...1 REFERENCE DOCUMENTS ASME Y14 5M 2009 STANDARD DIMENSION AND TOLERANCES UL1439 UL SHARP EDGE TESTING 2 FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD DATABASE 3 LABEL MATERIAL PET A...

Страница 106: ...THERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14 5M 1994 DIMENSIONS ARE IN MILLIMETERS THIRD ANGLE PROJECTION PARTS LIST DESCRIPTION PART NUMBER ITEM NO QTY TIM PCM45...

Страница 107: ...2 6 CHANGED TOLERANCE FROM 3 5 0 05 TO 3 5 0 5 0 7 MODIFIED NOTES ADDITIONAL INFORMATION TO NOTE 1 AND 3 8 NOTE 6 IS BOXED AND ADDED LEADER ARROWS W 6 CALLED OUT IN SECTION A A 9 ADDED NOTE 9 8 16 16...

Страница 108: ...8119 R 5 8 0 2 5 FULL THREADS MINIMUM 4 05 0 35 0 05 4 05 0 15 A H94876 2 F DWG NO SHT REV SHEET 2 OF 2 DO NOT SCALE DRAWING SCALE 13 F H94876 D REV DRAWING NUMBER SIZE DEPARTMENT E E SUPPLEMENTAL DES...

Страница 109: ...7 D5 B5 B3 D 1 O D HAS CHANGED FROM 8MM TO 7 8 2 THICKNESS HAS CHANGED FROM 0 5MM TO 0 7MM 3 MATERIAL SPEC CHANGED TO COLOR NOT SPECIFIED HOWEVER BLACK NOT SUGGESTED 03 08 17 NOTES UNLESS OTHERWISE SP...

Страница 110: ...INNER DIAMETER AND TOLERANCE FROM 6 0 05 TO 6 1 0 10 2 ROLLED THE PART NUMBER FROM H37265 003 TO H37265 004 9 30 15 NOTES UNLESS OTHERWISE SPECIFIED 1 REFERENCE DOCUMENTS 99 0007 001 INTEL WORKMANSHIP...

Страница 111: ...PHM Keep Out Zones are included in this appendix Table F 1 lists the mechanical drawings included in this appendix Table F 1 Mechanical Keep Out Zone Drawing List Description Figure Processor Heatsin...

Страница 112: ...TS PLACED ON THE SURFACE OF THE MOTHERBOARD MUST HAVE A MAXIMUM HEIGHT NO GREATER THAN THE HEIGHT DEFINED BY THAT ZONE AFTER REFLOW UNLESS OTHERWISE NOTED ALL VIEW DIMENSIONS ARE NOMINAL ALL HEIGHT RE...

Страница 113: ...AWING TAKE PRECEDENCE OVER SUPPLIED FILE 2 CENTERLINE OF SOCKET MUST BE PLACED SYMMETRIC TO THE PHM HOLE PATTER FOR PROPER PHM AND SOCKET FUNCTION 3 A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE A...

Страница 114: ...RIC TO THE PHM HOLE PATTERN FOR PROPER PHM AND SOCKET FUNCTION 3 A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE ALL COMPONENTS PLACED ON THE SURFACE OF THE MOTHERBOARD MUST HAVE A MAXIMUM HEIGHT NO...

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