Intel Xeon Phi Processor x200, Техническое руководство по тепловым и механическим характеристикам и конструкции

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Socket Mechanical Design
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002
30
.
Figure 3-9. Wetting Angle and Wetting Height
3.4 Socket Size
The socket size will meet the dimensions as shown in Appendix D , allowing full insertion
of the package into the socket without interference. This information should be used in
conjunction with the reference main board keep-out drawings provided in
Appendix F to
ensure compatibility with the reference thermal mechanical components.
3.5 Actuation and Insertion Requirements
3.5.1 Package Translation
The socket should be built so that the post-actuated seating plane of the package is
flush with the seating plane of the socket. Movement will be along the axis normal to
the seating plane.
3.5.2 Insertion/Removal/Actuation Forces
Any actuation will meet or exceed SEMI S8-95 Safety Guidelines for
Ergonomics/Human Factors Engineering of Semiconductor Manufacturing Equipment ,
example Table R2-7 (Maximum Grip Forces), available at http://www.semi.org/ .
The socket is designed so that no force is required to insert the package into the
socket, and no tool is required to insert or remove the package
.
Table 3-3. PnP Cover Ergonomics Requirements
Direction Description Min. Max. Comments
Vertical Closed position at 260
°
C 0.75 lbf - While holding at reflow temp.
Closed position at room
temperature.
3 lbf 22 lbf Pull off force for cap removal.
In and
Out of
Plane
Shock 0.8 lbf - During shipping.
In-Plane Removal - 1.7 lbf Will meet Ergonomic requirements.
PnP Cap - - +/- 3.5 mils placement accuracy; in-plane
slack.