Intel Xeon Phi Processor x200, Техническое руководство по тепловым и механическим характеристикам и конструкции

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Order Number: 334785-002 Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
23
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Socket Mechanical Design
• Contact Co-planarity 1
• PnP Cap Keep-in-zone Flatness 1
3.3 Socket Components
3.3.1 Socket Housing
The socket housing material should be thermoplastic or equivalent, UL 94 V-0 flame
rating, temperature rating and design capable of maintaining structural integrity
following a temperature of 260
 C for 40 seconds, which is typical of a reflow/rework
profile for solder material used on the socket. The material will have a thermal
coefficient of expansion in the XY plane capable of passing reliability tests rated for an
expected high operating temperature, mounted on low loss, low/High Tg FR4-type main
board material. The creep properties of the material will be such that the mechanical
integrity of the socket is maintained for the stress conditions outlined in
Appendix A .
3.3.1.1 Housing Color
The color of the socket housing will be dark as compared to the solder balls to provide
the contrast needed for OEM’s pick-and-place vision systems. Components of the
socket may be different colors, as long as they meet the above requirement.
3.3.1.2 Socket Insertable Alignment Keys
The alignment keys for the package-to-socket alignment, and to ensure that the
correct package is inserted into the socket, should be insertable keys with the option of
a molded key for the left socket half only.
3.3.1.3 Package Installation/Removal Access
Access will be provided to facilitate the manual insertion and removal of the package.
No tool should be required to install or remove the package from the socket.
3.3.1.4 Package Alignment/Orientation
A means of providing fixed alignment and proper orientation with the pin A1 corner of
the processor package will be provided. There are three different levels of package
alignment:
• The first level is called gross alignment, which occurs due to the Bolster Plate posts
and corresponding PHLM holes.
• The second level is called intermediate alignment, which utilizes the socket exterior
corner walls with a 1.25 mm by 1.75 mm chamfer at the guiding portion.
• The third level is called fine alignment, which relies on the socket corner inner
surfaces (datum walls) with a 0.75 mm by 1.00 mm chamfer at the guiding portion.