Intel Xeon Phi Processor x200, Техническое руководство по тепловым и механическим характеристикам и конструкции

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Order Number: 334785-002 Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
15

Processor Mechanical Design
2.3.1 Package Critical-to-Function Attributes
The processor package land dimension details, base material, plating material and
plating thickness are provided in
Appendix C . The following is a list of package Critical-
to-Function (CTF) attributes. CTF values are detailed on the processor package
drawings in
Appendix C :
• Package Alignment Length
• Package Alignment Width
• Package Substrate Thickness
• Land Length
• Land Width
• Land True Position (Pattern Relating)
• Land Co-planarity
• Substrate Flatness
2.3.2 Other Processor Package Specific Design Attributes
Refer to Table C-1 for additional information on package markings, KOZs, tolerances,
parallelism, and tilt. Key package features and design attributes are enumerated below
in
Figure 2-4 , these include:
• Package Product ID socket keying notch
• Package PHM alignment keying notch
• Package Pin 1 Indicator (shown in
Figure 2-5 and Figure 2-6 )
Figure 2-4. Processor with Fabric Package Features and Design Attributes