LGA1156 Socket
26
Thermal/Mechanical Specifications and Design Guidelines
.
3.5.1
Socket Standoffs and Package Seating Plane
Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in
Similarly, a seating plane on the top-side of the socket establishes the minimum
package height. See
for the calculated IHS height above the motherboard.
3.6
Durability
The socket must withstand 20 cycles of processor insertion and removal. The max
chain contact resistance from
must be met when mated in the 1st and 20th
cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
Figure 3-7. Package Installation / Removal Features
Pin 1
Chamfer
Package
Pin 1
Indicator
Alignment
Post
(2 Places)
Finger
Access
(2 Places)
Orientation
Notch
(2 Places)
Содержание BX80605X3440 - Quad Core Xeon X3440
Страница 10: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Страница 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...
Страница 78: ...Component Suppliers 78...
Страница 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...
Страница 81: ...81 Mechanical Drawings Figure B 2 Socket Heatsink ILM Keepout Zone Secondary Side for 1U Bottom...
Страница 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...
Страница 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...
Страница 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...
Страница 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...
Страница 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...
Страница 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...
Страница 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...
