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Package Mechanical and Storage Specifications

Thermal/Mechanical Specifications and Design Guidelines

2.2

Processor Storage Specifications

Table 2-4

includes a list of the specifications for device storage in terms of maximum

and minimum temperatures and relative humidity. These conditions should not be
exceeded in storage or transportation.

Notes:

Refers to a component device that is not assembled in a board or socket that is not to be electrically

connected to a voltage reference or I/O signals.

Specified temperatures are based on data collected. Exceptions for surface mount reflow are specified in

applicable JEDEC standard and MAS document. Non-adherence may affect processor reliability.

ABSOLUTE STORAGE

applies to the unassembled component only and does not apply to the shipping media,

moisture barrier bags or desiccant.

Intel

branded board products are certified to meet the following temperature and humidity limits that are

given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C, Humidity: 50% to 90%,

non-condensing with a maximum wet bulb of 28 °C). Post board attach storage temperature limits are not

specified for non-Intel branded boards.

The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture

sensitive devices removed from the moisture barrier bag.

Nominal temperature and humidity conditions and durations are given and tested within the constraints

imposed by T

SUSTAINED

and customer shelf life in applicable Intel box and bags.

Table 2-4.

Storage Conditions

Parameter Description

Min

Max

Notes

ABSOLUTE STORAGE

The non-operating device storage

temperature. Damage (latent or otherwise)

may occur when subjected to for any length of

time.

-55 °C

125 °C

SUSTAINED STORAGE

The ambient storage temperature limit (in

shipping media) for a sustained period of time.

-5 °C

40 °C

SUSTAINED STORAGE

The maximum device storage relative humidity

for a sustained period of time.

60% @ 24 °C

TIME

SUSTAINED STORAGE

A prolonged or extended period of time;

typically associated with customer shelf life.

Months

Содержание BX80605X3440 - Quad Core Xeon X3440

Страница 1: ...Reference Number 322374 001 Intel Xeon Processor 3400 Series and LGA1156 Socket Thermal Mechanical Specifications and Design Guidelines September 2009...

Страница 2: ...es arising from future changes to them The Intel Xeon Processor 3400 Series and LGA1156 socket may contain design defects or errors known as errata which may cause the product to deviate from publishe...

Страница 3: ...cations 33 5 1 Component Mass 33 5 2 Package Socket Stackup Height 33 5 3 Socket Maximum Temperature 33 5 4 Loading Specifications 34 5 5 Electrical Requirements 35 5 6 Environmental Requirements 36 6...

Страница 4: ...or 3400 Series 95W 39 6 2 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor 3400 Series 45W 41 6 3 TTV Case Temperature TCASE Measurement Location 44 6 4 Frequency and Voltage Ordering 46...

Страница 5: ...3 2 3 Processor Materials 14 2 4 Storage Conditions 16 5 1 Socket Component Mass 33 5 2 1156 land Package and LGA1156 Socket Stackup Height 33 5 3 Socket ILM Mechanical Specifications 34 5 4 Electrica...

Страница 6: ...6 Thermal Mechanical Specifications and Design Guidelines Document Number Revision Number Description Revision Date 322374 001 Initial release September 2009...

Страница 7: ...could refer to Intel Core i7 800 and i5 700 Desktop Processor Series and LGA1156 Socket Thermal Mechanical Specifications and Design Guidelines Note When the information is applicable to all products...

Страница 8: ...efined as TCASE TLA Total Package Power The heat source should always be specified for measurements CS Case to sink thermal characterization parameter A measure of thermal interface material performan...

Страница 9: ...olutions TLA The measured ambient temperature locally surrounding the processor The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsin...

Страница 10: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...

Страница 11: ...es as the mating surface for processor thermal solutions such as a heatsink Figure 2 1 shows a sketch of the processor package components and how they are assembled together Refer to Chapter 3 and Cha...

Страница 12: ...nt keep out dimensions 5 Reference datums 6 All drawing dimensions are in mm 2 1 2 Processor Component Keep Out Zones The processor may contain components on the substrate that define component keep o...

Страница 13: ...ckage Handling Guidelines Table 2 2 includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate These package handling...

Страница 14: ...Component Material Integrated Heat Spreader IHS Nickel Plated Copper Substrate Fiber Reinforced Resin Substrate Lands Gold Plated Copper Figure 2 3 Processor Top Side Markings Legend GRP1LINE1 GRP1LIN...

Страница 15: ...oordinates Figure 2 4 shows the bottom view of the processor package Figure 2 4 Processor Package Lands Coordinates AY AV AT AP AM AK AH AF AD AB Y V T P M K H F D B AW AU AR AN AL AJ AG AE AC AA W U...

Страница 16: ...given as an example only Non Operating Temperature Limit 40 C to 70 C Humidity 50 to 90 non condensing with a maximum wet bulb of 28 C Post board attach storage temperature limits are not specified f...

Страница 17: ...surface mounting on the motherboard The contacts are arranged in two opposing L shaped patterns within the grid array The grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the arr...

Страница 18: ...3 7 5 9 11 15 13 17 19 23 21 25 27 29 2 8 4 6 10 16 12 14 18 24 20 22 26 28 30 15 11 13 17 23 19 21 25 31 27 29 33 39 35 37 32 14 12 16 18 22 20 24 26 30 28 34 38 36 40 A C E G J L N R U W AA AC AE AG...

Страница 19: ...W AA AC AE AG AJ AL AN AR AU AW B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY 1 3 7 5 9 11 15 13 17 19 23 21 25 27 29 2 8 4 6 10 16 12 14 18 24 20 22 26 28 30 32 15 11 14 12 13 16 17 23 19 18 22 2...

Страница 20: ...20 21 24 25 31 27 26 30 28 29 33 39 35 34 38 36 37 40 A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY 1 3 7 5 9 11 15 13 17 19 23 21 25 27 29 2 8 4...

Страница 21: ...al assembly Refer to Appendix C for detailed drawings 3 4 1 Socket Body Housing The housing material is thermoplastic orequivalent with UL 94 V 0 flame rating capable of withstanding 260 C for 40 seco...

Страница 22: ...e contact area is allowed during solder reflow 3 4 4 Pick and Place Cover The cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology SMT manufactur...

Страница 23: ...ual reference for proper orientation The package substrate has orientation notches along two opposing edges of the package offset from the centerline The socket has two corresponding orientation posts...

Страница 24: ...the minimum package height See Section 5 2 for the calculated IHS height above the motherboard 3 6 Durability The socket must withstand 20 cycles of processor insertion and removal The max chain conta...

Страница 25: ...erboard LGA1156 and the manufacturer s insignia are molded or laser marked on the side wall 3 8 Component Insertion Forces Any actuation must meet or exceed SEMI S8 95 Safety Guidelines for Ergonomics...

Страница 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...

Страница 27: ...porate critical design parameters 4 1 Design Concept The ILM consists of two assemblies that will be procured as a set from the enabled vendors These two components are ILM cover assembly and back pla...

Страница 28: ...at the center of the plate to allow access to test points and backside capacitors if required An insulator is pre applied A notch is placed in one corner to assist in orienting the back plate during a...

Страница 29: ...rew is available for local sourcing of this component Refer to Figure B 16 for the custom 6 32 thread shoulder screw drawing The standard fasteners can be sourced locally The design assumes this faste...

Страница 30: ...ture 2 Install the shoulder screw in the single hole near Pin 1 of the socket Torque to a minimum and recommended 8 inch pounds but not to exceed 10 inch pounds 3 Align and place the ILM cover assembl...

Страница 31: ...le manufacturability and reliability with a socket body from Vendor A B or C ILM cover assemblies and ILM back plates from all vendors are also interchangeable The ILMs are an integral part of the soc...

Страница 32: ...a Bold minimum 6 point 2 125 mm Manufacturer s insignia font size at supplier s discretion Lot identification code allows traceability of manufacturing date and location Pin 1 indicator on the load pl...

Страница 33: ...ight of the package from the package seating plane to the top of the IHS and accounting for its nominal variation and tolerances that are given in the corresponding processor datasheet 2 The integrate...

Страница 34: ...ic load requirement 6 Test condition used a heatsink mass of 500gm 1 102 lb with 50 g acceleration table input and an assumed 2X Dynamic Acceleration Factor DAF The dynamic portion of this specificati...

Страница 35: ...socket Socket Average Contact Resistance EOL 19 mOhm The socket average contact resistance target is calculated from the following equation sum Ni X LLCRi sum Ni LLCRi is the chain resistance defined...

Страница 36: ...ased reliability evaluation methodology which is acceleration factor dependent A simplified process flow of this methodology can be seen in Figure 5 1 A detailed description of this methodology can be...

Страница 37: ...iability Selection of the appropriate fan speed is based on the relative temperature data reported by the processor s Digital Temperature Sensor DTS The DTS can be read using the Platform Environment...

Страница 38: ...at specified ICCP Please refer to the loadline specifications in the EDS 7 Thermal Design Power TDP should be used for processor thermal solution design targets TDP is not the maximum power that the...

Страница 39: ...ase refer to Table 6 2 for discrete points that constitute the thermal profile 2 Refer to Chapter 8 and Chapter 9 for system and environmental implementation details Figure 6 1 Thermal Test Vehicle Th...

Страница 40: ...SE_MAX C Power W TCASE_MAX C 0 45 1 50 59 6 2 45 7 52 60 2 4 46 3 54 60 8 6 46 8 56 61 3 8 47 4 58 61 9 10 48 0 60 62 5 12 48 6 62 63 1 14 49 2 64 63 7 16 49 7 66 64 2 18 50 3 68 64 8 20 50 9 70 65 4...

Страница 41: ...hapter 8 and Chapter 9 for system and environmental implementation details Figure 6 2 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor 3400 Series 45W Table 6 3 Thermal Test Vehicle Therm...

Страница 42: ...ation ambient temperature monitoring is necessary Notes 1 The ambient temperature is measured at the inlet to the processor thermal solution 2 This column can be expressed as a function of TAMBIENT by...

Страница 43: ...89 45 2 TAMBIENT x 0 0222 Table 6 5 Thermal Solution Performance above TCONTROL for the Intel Xeon Processor 3400 Series 45W TAMBIENT 1 CA at DTS TCONTROL 2 CA at DTS 13 45 2 0 290 0 289 44 0 0 332 0...

Страница 44: ...The vendor part number is XTMS1565 6 2 Processor Thermal Features 6 2 1 Processor Temperature A new feature in the processors is a software readable field in the IA32_TEMPERATURE_TARGET register that...

Страница 45: ...olution that is not able to prevent excessive activation of the TCC in the anticipated ambient environment may cause a noticeable performance loss and in some cases may result in a TCASE that exceeds...

Страница 46: ...timer has expired the operating frequency and voltage transition back to the normal system operating point using the intermediate VID frequency points Transition of the VID code will occur first to in...

Страница 47: ...hen the Critical Temperature Flag in the IA32_THERM_STATUS MSR will be set This flag is an indicator of a catastrophic thermal solution failure and that the processor cannot reduce its temperature Unl...

Страница 48: ...implements a PECI interface to allow communication of processor thermal and other information to other devices on the platform The processor provides a digital thermal sensor DTS for fan speed contro...

Страница 49: ...target The temperature data reported over PECI is always a negative value and represents a delta below the onset of thermal control circuit TCC activation as indicated by PROCHO T Therefore as the te...

Страница 50: ...nt represents roughly a temperature change of 1 degree centigrade This linearity is approximate and cannot be ensured over the entire range of PECI temperatures especially as the delta from the maximu...

Страница 51: ...Digital Thermal Sensor DTS for real time thermal specification compliance Single point of reference for thermal specification compliance over all operating conditions Does not require measuring proce...

Страница 52: ...a defined thermal solution performance CA as a function of the DTS value as reported over the PECI bus when DTS is greater than TCONTROL This defines the operational limits for the processor using the...

Страница 53: ...the socket and powered to the recommended value to simulate the TDP condition See Figure 7 2 for an example of the Intel Xeon processor 3400 series 95W TTV thermal profile Note This graph is provided...

Страница 54: ...ts are accessible in real time for the fan speed control system As a result the designer had to assume the worst case TAMBIENT and drive the fans to accommodate that boundary condition 7 3 Thermal Sol...

Страница 55: ...nt impact on the required CA needed to meet TTV TCASEMAX at TDP A system that can deliver lower assumed TAMBIENT can utilize a design with a higher CA which can have a lower cost Figure 7 3 shows a nu...

Страница 56: ...hermal Solution Characterization for Fan Speed Control The final step in thermal solution validation is to establish the thermal solution performance CA and acoustics as a function of fan speed This d...

Страница 57: ...pliant solution and some acoustic benefit by operating the processor closer to the thermal profile But only the TAMBIENT aware FSC system can fully use the specification for optimized acoustic perform...

Страница 58: ...ing item Verify if there is TCC activity by instrumenting the PROCHOT signal from the processor TCC activation in functional application testing is unlikely with a compliant thermal solution Some very...

Страница 59: ...server These values are used to provide guidance for heatsink design Notes 1 The values in Table 8 1 are from final design review 2 Max target mean 3 sigma for thermal characterization parameter 3 Ai...

Страница 60: ...s calculated as Y 0 319 X 40 where Y Processor TCASE Value C X Processor Power Value W Table 8 2 shows thermal solution performance is compliant with Intel Xeon processor 3400 series 95W TTV thermal p...

Страница 61: ...ion TCASE_MAX C 0 45 1 40 0 50 59 6 56 0 2 45 7 40 6 52 60 2 56 6 4 46 3 41 3 54 60 8 57 2 6 46 8 41 9 56 61 3 57 9 8 47 4 42 6 58 61 9 58 5 10 48 0 43 2 60 62 5 59 1 12 48 6 43 8 62 63 1 59 8 14 49 2...

Страница 62: ...ance hole is located at the center of the heatsink backplate to accommodate the ILM back plate An insulator is pre applied Note Heatsink back plate herein is only applicable to 1U server Desktop has a...

Страница 63: ...the heatsink fins are parallel to system airflow While lowering the heatsink onto the IHS align the four captive screws of the heatsink to the four holes of motherboard Using a 2 Phillips driver torq...

Страница 64: ...on uses Honeywell PCM45F which pad size is 35x35 mm TIM should be verified to be within its recommended shelf life before use Surfaces should be free of foreign materials prior to application of TIM F...

Страница 65: ...olume Some general recommendations are shown in Table 9 1 The Intel collaboration heatsinks have been tested in an assembled LGA1156 socket and mechanical test package Details of the environmental req...

Страница 66: ...processor IHS No visible tilt of the heatsink with respect to the retention hardware 3 No signs of physical damage on baseboard surface due to impact of heatsink 4 No visible physical damage to the pr...

Страница 67: ...materials are not fungal growth resistant then MIL STD 810E Method 508 4 must be performed to determine material performance Material used shall not have deformation or degradation in a temperature l...

Страница 68: ...Thermal Solution Quality and Reliability Requirements 70 Thermal Mechanical Specifications and Design Guidelines...

Страница 69: ...system integrators Note Unless otherwise noted all figures in this chapter are dimensioned in millimeters and inches in brackets Figure 10 1 shows a mechanical representation of a boxed processor Note...

Страница 70: ...the fan heatsink to ensure unimpeded airflow for proper cooling The physical space requirements and dimensions for the boxed processor with assembled fan heatsink are shown in Figure 10 2 side view a...

Страница 71: ...sor Specifications Note Diagram does not show the attached hardware for the clip design and is provided only as a mechanical representation Figure 10 3 Space Requirements for the Boxed Processor top v...

Страница 72: ...2 pulses per fan revolution A baseboard pull up resistor provides VOH to match the system board moun ted fan speed monitor requirements if applicable Use of the SENSE signal is optional If the SENSE s...

Страница 73: ...ides of the fan heatsink Airspace is required around the fan to ensure that the airflow through the fan heatsink is not blocked Blocking the airflow to the fan heatsink reduces the cooling efficiency...

Страница 74: ...tions 76 Thermal Mechanical Specifications and Design Guidelines Figure 10 7 Boxed Processor Fan Heatsink Airspace Keepout Requirements top view Figure 10 8 Boxed Processor Fan Heatsink Airspace Keepo...

Страница 75: ...tsink to fan heatsink The internal chassis temperature should be kept below 40 C Meeting the processor s temperature specification see Chapter 6 is the responsibility of the system integrator The moth...

Страница 76: ...ution provides better control over chassis acoustics This is achieved by more accurate measurement of processor die temperature through the processor s Digital Thermal Sensors DTS and PECI Fan RPM is...

Страница 77: ...e supplier directly to verify time of component availability Table A 1 Collaboration Heatsink Enabled Components Item Intel PN AVC 1U heatsink Assembly E49069 001 SQ41900001 Heatsink Back Plate Assemb...

Страница 78: ...Component Suppliers 78...

Страница 79: ...re B 3 Socket Processor ILM Keepout Zone Secondary Side for 1U Bottom Figure B 4 1U Collaboration Heatsink Assembly Figure B 5 1U Collaboration Heatsink Figure B 6 1U Collaboration Heatsink Screw Figu...

Страница 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...

Страница 81: ...81 Mechanical Drawings Figure B 2 Socket Heatsink ILM Keepout Zone Secondary Side for 1U Bottom...

Страница 82: ...DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP INS 2 SOCKET KEEP IN VOLUME VERTICAL HEIGHT ESTABLISHES LIMIT OF SOCKET AND CPU PACKAGE ASSEMBLY IN THE SOCKET LOCKED DOWN POSITION IT ENCOMPASSES SOCKE...

Страница 83: ...HER LAYERS COPPER PAD ON PRIMARY SIDE NON GROUNDED COPPER PAD CAN INSET MAXIMUM OF 127MM FROM THE NO ROUTE EDGE 6 00 0 05 0 03 3X NPTH 3 80 0 05 0 03 11 78 8 00 3 50 17 00 18 12 10 97 3 50 6 30 35 21...

Страница 84: ...2 4 D91472 3 4 E49059 4 1 E50686 5 4 PCM 45F 6 1 REVISION HISTORY ZONE REV DESCRIPTION DATE APPR 1 A INITIAL RELEASE 07 15 08 2 B UPDATE 09 20 08 3 0 5 0 20 0 25 NOTES 1 THIS DRAWING TO BE USED IN CON...

Страница 85: ...XX 0 25 XXX 0 025 THIRD ANGLE PROJECTION PARTS LIST DESCRIPTION PART NUMBER ITEM NO QTY E49059 TOP REVISION HISTORY ZONE REV DESCRIPTION DATE APPR 1 A INITIAL RELEASE 07 15 08 2 B UPDATE 09 20 08 3 C...

Страница 86: ...REVISION HISTORY ZONE REV DESCRIPTION DATE APPR 1 A INITIAL RELEASE 07 20 08 2 B ADDED MAJOR SCREW DIA AS CTF UPDATED SHAFT INSPECTION CRITERIA ADDED NOTE 7 ADDED SHOULDER NOTE 01 19 09 2 X 6 4 06 0...

Страница 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...

Страница 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...

Страница 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...

Страница 90: ...2 1 HS BACKPLATE STANDOFF E49063 001 3 4 REVISION HISTORY ZONE REV DESCRIPTION DATE APPR 1 A INITIAL RELEASE 04 10 08 2 B UPDATE 07 20 08 3 C ADDED PLATING CORROSION REQUIREMENT 01 21 09 6 89 25 6 92...

Страница 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...

Страница 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...

Страница 93: ...5 XX 0 25 XXX 0 025 THIRD ANGLE PROJECTION PARTS LIST DESCRIPTION PART NUMBER ITEM NO QTY TOP REVISION HISTORY ZONE REV DESCRIPTION DATE APPR 1 A INITIAL RELEASE 04 10 08 2 B REDEFINE THE HEIGHT OF ST...

Страница 94: ...5 6 0 7 5 6 1 3 7 233 5 87 5 7 21 25 17 7 21 2 5229 6 6 6 2 1 0 1 6 5 72 5 2 8556 7 37 7 7 3 17 5 6 5 7 352 7 21 0 7 5 7 5 1 2 127 6 5 1 5 1 180 5 1 6 33529 5 1 6 7 7 7 6 7 7 2 6 1 7 1 5 5 21 6 7 2 5...

Страница 95: ...INISH MATERIAL DATE APPROVED BY DATE CHECKED BY 05 19 08 JUN LU DATE DRAWN BY 05 19 08 JUN LU DATE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y1...

Страница 96: ...D638 235 MPa 6 PLATING 2 MICRON MIN ELECTROLYTIC BLACK NICKEL PLATING 7 REFERENCE AND UNDIMENSIONED FEATURES MAY BE MODIFIED PER INTEL APPROVAL 8 DELETED E49066 001 1 B DWG NO SHT REV DEPARTMENTR 220...

Страница 97: ...lists the mechanical drawings included in this appendix Table C 1 Mechanical Drawing List Drawing Description Figure Number Socket Mechanical Drawing Sheet 1 of 4 Figure C 1 Socket Mechanical Drawing...

Страница 98: ...NUMBER SHALL BE INDICATED IN THIS AREA 8 CHAMFER INDICATES THE CORNER CLOSEST TO PACKAGE PIN A1 9 CONTACT MUST REMAIN OUTSIDE THE CENTRAL CAVITY THROUGHOUT THE ACTUATION STROKE 10 PICK AND PLACE TOOLI...

Страница 99: ...X 15 5 4 2 9 2 1 5 2 35 15 96 0 5 16 25 F G THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED...

Страница 100: ...NTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION E27147 3 4 DWG NO SHT REV DEPARTMENT R 2200 MISSION COLLEGE BLVD P O BOX 58119 SANTA...

Страница 101: ...MAX 0 6 2X 8 20 18 12 2X 4 5 MAX 2X 2 0 0 1 24 56 0 1 THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED...

Страница 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...

Страница 103: ...al Drawings D Package Mechanical Drawings Table D 1 lists the mechanical drawings included in this appendix Table D 1 Mechanical Drawing List Drawing Description Figure Number Processor Package Drawin...

Страница 104: ...MBER REV A1 E22526 6 SCALE 5 DO NOT SCALE DRAWING SHEET 1 OF 2 FINISH MATERIAL DATE APPROVED BY DATE CHECKED BY DATE DRAWN BY DATE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLER...

Страница 105: ...RMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION E22526 2 6 DWG NO SHT REV DEPART...

Страница 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...

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