Thermal/Mechanical Specifications and Design Guidelines
19
LGA1156 Socket
3
LGA1156 Socket
This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the
processors. The socket provides I/O, power, and ground contacts. The socket contains
1156 contacts arrayed about a cavity in the center of the socket with lead-free solder
balls for surface mounting on the motherboard.
The contacts are arranged in two opposing L-shaped patterns within the grid array. The
grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the array and
selective depopulation elsewhere.
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The ILM design includes a back plate that is integral to
having a uniform load on the socket solder joints. Socket loading specifications are
listed in
.
Figure 3-1. LGA1156 Socket with Pick and Place Cover
Содержание BX80605X3440 - Quad Core Xeon X3440
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Страница 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...
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Страница 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...
Страница 81: ...81 Mechanical Drawings Figure B 2 Socket Heatsink ILM Keepout Zone Secondary Side for 1U Bottom...
Страница 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...
Страница 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...
Страница 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...
Страница 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...
Страница 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...
Страница 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...
Страница 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...
