Intel BX80605X3440 - Quad Core Xeon X3440, Справочник

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Introduction
10 Thermal/Mechanical Specifications and Design Guidelines
1.2 Definition of Terms
Table 1-2. Terms and Descriptions (Sheet 1 of 2)
Term Description
Bypass Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
CTE Coefficient of Thermal Expansion. The relative rate a material expands during a thermal
event.
DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC
activation temperature.
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
ILM Independent Loading Mechanism provides the force needed to seat the 1156-LGA land
package onto the socket contacts.
PCH Platform Controller Hub. The PCH is connected to the processor via the Direct Media
Interface (DMI) and Intel
®
Flexible Display Interface (Intel
®
FDI).
LGA1156 socket The processor mates with the system board through this surface mount, 1156-land
socket.
PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides
a communication channel between Intel processor and chipset components to external
monitoring devices.
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
CASE
– T
LA
) / Total
Package Power. The heat source should always be specified for Ψ measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
CASE
– T
S
) / Total Package
Power.
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
S
– T
LA
) / Total Package Power.
T
CASE
or T
C
The case temperature of the processor, measured at the geometric center of the topside
of the TTV IHS.
T
CASE
_
MAX
The maximum case temperature as specified in a component specification.
TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by
using clock modulation and/or operating frequency and input voltage adjustment when
the die temperature is very near its operating limits.
T
CONTROL
T
CONTROL
is a static value that is below the TCC activation temperature and used as a
trigger point for fan speed control. When DTS > T
CONTROL
, the processor must comply
with the TTV thermal profile.
TDP Thermal Design Power: Thermal solution should be designed to dissipate this target
power level. TDP is not the maximum power that the processor can dissipate.
Thermal Monitor A power reduction feature designed to decrease temperature after the processor has
reached its maximum operating temperature.
Thermal Profile Line that defines case temperature specification of the TTV at a given power level.
TIM Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.