Thermal Specifications
38
Document Number: 424077 Revision: 2.0Thermal/Mechanical
Specifications and Design Guidelines
. To ensure maximum flexibility for future processors, systems should be
designed to the Thermal Solution Capability guidelines, even if a processor with lower
power dissipation is currently planned.
Notes:
1.
The package C-state power is the worst case power in the system configured as follows:
- Memory configured for DDR3 1333 and populated with 2 DIMM per channel.
- DMI and PCIe links are at L1.
2.
Specification at DTS = -50 and minimum voltage loadline.
3.
Specification at DTS = -50 and minimum voltage loadline.
4.
Specification at DTS = -64 and minimum voltage loadline.
5.
) are based on the TCC Activation MSR having a value of 100, see
6.
These values are specified at V
CC_MAX
and V
NOM
for all other voltage rails for all processor frequencies.
Systems must be designed to ensure the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CCP
exceeds V
CCP_MAX
at specified I
CCP
. Please refer to the loadline specifications in
the EDS.
7.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at DTS = -1.
TDP is achieved with the Memory configured for DDR3 1333 and 2 DIMMs per channel.
8.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements. The FMB 2009B (09B) is equivalent to the thermal requirements for the Intel®
Core™ 2 Quad Q9000 processor series. The FMB 2009A (09A) is equivalent to the thermal requirements for
the Intel® Core™ 2 Duo E8000 processor series. Reuse of those thermal solutions is recommended with
the updated mechanical attach to straddle the LGA1156 socket.
9.
Not 100% tested. Specified by design characterization.
Table 6-1.
Intel
®
Xeon
®
Processor 3400 Series Thermal Specifications
Product
FMB
Max
Power
Package
C1E
(W)
Max
Power
Package
C3
Max
Power
Package
C6
(W)
TTV
Thermal
Design
Power
(W)
Min T
CASE
(°C)
Maximum
TTV
TCASE
(°C)
Intel
®
Xeon
®
processor 3400
series (95W)
2009B
(09B)
28
22
5.5
95
5
Intel
®
Xeon
®
processor 3400
series (45W)
2009A
(09A)
21
17
4.0
45
Содержание BX80605X3440 - Quad Core Xeon X3440
Страница 10: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Страница 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...
Страница 78: ...Component Suppliers 78...
Страница 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...
Страница 81: ...81 Mechanical Drawings Figure B 2 Socket Heatsink ILM Keepout Zone Secondary Side for 1U Bottom...
Страница 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...
Страница 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...
Страница 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...
Страница 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...
Страница 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...
Страница 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...
Страница 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...
