2.
The following illustration shows the replacement thermal material locations. The thermal material must
be thoroughly cleaned from the surfaces of the heat sink and the system board components each time
the heat sink is removed. Replacement thermal material is included with the heat sink and system board
spare part kits.
Thermal paste is used on the system board components (2), (4), (6) and on the heat sink areas (1), (3),
(5) that service them.
Heat sink for use with models with UMA graphics memory
1.
Remove the screws in the order shown (1 – 4) and then remove the heat sink (5) from the system board.
Component replacement procedures
59
Содержание ZBook 17 G3
Страница 1: ...HP ZBook 17 G3 Mobile Workstation Maintenance and Service Guide ...
Страница 4: ...iv Important Notice about Customer Self Repair Parts ...
Страница 6: ...vi Safety warning notice ...
Страница 14: ...xiv ...
Страница 158: ...6 Open the crash dump file 144 Chapter 7 Troubleshooting guide ...